Nowadays PCB design time is getting shorter, smaller and smaller board space, higher and higher device density, extremely demanding layout rules and large size components make the designer's job more difficult.
high speed circuit design technology has become the electronic system designers must take the design means. The controllability of the design process can only be achieved by using the design techniques of high speed circuit designers.
n electronic product that does not conform to EMC specifications is not an acceptable electronic design. In addition to meeting market functional requirements, design products must also adopt appropriate design techniques to prevent or relieve EMI effects
After the circuit is completed, solder resistance ink is coated on the circuit as protection of the circuit. There are liquid photosensitive, heat curing and UV hardening.
Our electronic products are often more than 60% - reliability problems are in the PCB design of the electronic circuit board; Relevant theoretical and practical experience is required for working and performing PCBS;
In the high-speed era, the ideal wiring on any section of schematic diagram has become an unsatisfactory wiring on PCB, bringing a variety of unexpected high-speed problems. Therefore, PCB engineers also need to accumulate experience and theoretical knowl
For circuits with large redundancy of power pins, the number of matched capacitors can also be calculated according to the number of output pins, and every 5 outputs is matched with a 100nf filter capacitor.
Many manufacturers need to customize antenna products to ensure strong signal and stable signal. For antenna customization, we need to pay attention to many details in order to customize the best solution.
Traditional hard board material is hard, can not adapt to the development of electronic products miniaturization, high density, light weight.
the traditional physical plate making method is labor-intensive, time-consuming and has low precision, while the chemical rapid plate making method has a controllable precision, but the process is complicated and unfavorable to environmental protection. B
Mobile terminal with HDI board is the main point of PCB growth. The mobile terminal represented by smart phone drives HDI board higher density and thinner. PCB all to high density fine line development, HDI board is particularly prominent.
Many microelectronic devices (such as accelerometers, gyroscopes, deep ultraviolet leds, etc.) chips are very sensitive to air, moisture, dust, etc.
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