Low temperature co-fired ceramic (LTCC) substrate circuit machining
At present, there are two kinds of metallization methods for LTCC subgrade plate: thick film sintering method and sputtering film plating thickening method.
Professional PCB manufacturing and assembly
Building 6, Zone 3, Yuekang Road,Bao'an District, Shenzhen, China
+86-13923401642Mon.-Sat.08:00-20:00
Low temperature co-fired ceramic (LTCC) substrate
Low temperature co-fired ceramics (LTCC) is a multi-layer ceramic manufacturing technology that integrates interconnection, componentless and encapsulation.
The four elements of characteristic impedance are developed in the manufacture of pcb circuit boards
Although the miniaturization trend makes it more challenging, it is possible to use multiple connector groups on two PCB boards by using best design practices.
How to reduce PCB board space with the smallest device?
Chip-on-chip (WCSP) or core-sized ball grid arrays (DSBGA) use fine-pitch wire bonding and flip-chip interconnection, and are available in SiP, modular, stacked and recessed core-based formats.
PCB circuit board processing and production difficulty in where?
The high-rise plate is thicker, heavier and larger than the conventional multilayer plate. The corresponding heat capacity is also larger. When welding, more heat is needed and the welding high temperature time is longer.
From PCB to IC carrier to class carrier
In order to achieve the smaller space, faster speed, higher performance of the goal, the printed circuit board "light, thin, short, small" requirements continue to improve, PCB board structure requirements continue to improve.
How to design the high frequency PCB board of microwave circuit?
Many peers have completed the planning of electronic products often appear problems. Related to the lack of necessary elements in the planning of electrical principles, but more important is when all necessary elements are considered.
PCB proofing ceramic substrate production has those processes
The manufacturing process of dry press PCB electronic ceramics mainly includes blank forming, blank sintering and finishing, forming circuit on the substrate.
The difference between flexible PCB and traditional PCB and flexible PCB application
These PCBS are widely used in mechanically sensitive devices because the flexibility allows the board to resist vibration. Flexible PCB is more durable than traditional PCB, but flexible PCB manufacturing process is sensitive and complex.
Why are ceramic PCBS so expensive? What's the difference with ordinary PCB
Ordinary PCB is usually made of copper foil and substrate bonding, and the main material of ceramic substrate is alumina, beryllium oxide, aluminum nitride and other metal oxide ceramics, the performance of the two is quite different.
IC carrier plate and soft and hard combined plate, high-frequency plate difference
Soft and hard combined board refers to the combination of soft board and hard board, high frequency board refers to the special circuit board with higher electromagnetic frequency, IC carrier board is a technology.
Explain PCB high frequency board and classification
The presets need to contain both electrical and structural reliability. Generally in the preset very high speed PCB wrench (greater than GHz frequency) this board problem will be relatively tight.
Telegram
Just upload Gerber files, BOM files and design files, and the KINGFORD team will provide a complete quotation within 24h.