PCB process edge function, production method and design requirements
The role of PCB process edge: process edge is the part added on both sides or four sides of PCB board, mainly to assist the patch plug-in welding plate
The role of PCB process edge: process edge is the part added on both sides or four sides of PCB board, mainly to assist the patch plug-in welding plate
PCB board common bad reasons: 1, short circuit, 2, open circuit, 3, PCB board dark and granular contact, 4, PCB board solder joint into golden yellow, 5, environmental impact
Common heat dissipation mode of circuit board: 1, high heating device plus radiator, heat conduction plate, 2, through the circuit board itself heat dissipation, 3, the use of reasonable design to achieve heat dissipation function, 4, for the use of free
Soft and hard combined board PCB design points: 1, flexible area line design requirements, 2, dimensional stability, 3, covering film window design, 4, rigid flexible transition zone design, 5, flexible zone design with air-gap requirements
The application of wave-crest welding technology and reflow welding technology are completely different in component layout design, PCB and pad graphic design and hole design.
In PCB processing and production, static electricity is not the hazard, the real danger lies in the accumulation of static electricity, and the resulting electrostatic discharge.
In the process of production, packaging and transportation, and the processing, debugging and testing of the integrated machine, it is inevitable to suffer from external or own friction and form a high surface potential.
How to route the key signals of PCB design: first, analog signal wiring requirements, second, high-speed signal wiring requirements, third, clock signal wiring requirements
SMT patch processing emphasizes fast and efficient production. General SMT patch workshops will carry out non-stop production. The shutdown and line change of machines will increase production costs and reduce profits.
Aluminum is a very attractive material with abundant resources, low cost, excellent thermal conductivity and strength. In addition, it is very environmentally friendly and can be used on most metal substrates or cores.
During SMT processing, plug holes are required, which have five main functions:1. Prevent short circuit caused by tin penetrating through the component surface from the passthrough hole during wave soldering of PCB; 2. Avoid flux residue in the pass hole.
Four characteristics of PCB gold sinking process: 1. Gold sinking plate bright color, good color, beautiful, enhance the appeal to customers. 2. The crystal structure formed by sinking gold is easier to weld and has better performance to ensure the qualit