What are the tips for PCB wiring?
Almost all PCB design software includes a tool called an autocabler, but the autocabler never does the wiring for itself.
Almost all PCB design software includes a tool called an autocabler, but the autocabler never does the wiring for itself.
The purpose of thawing back temperature: can make the flux and tin powder evenly distributed, so as to give full play to the various characteristics of tin paste; The viscosity and activity of the solder paste after refrigeration are different from that o
PCBA processing and welding process requirements for PCB board: 1. Heat resistance, 2. PCB shape, 3. PCB size, 5. PCB process edge, 6. PCB reference identification point, 7. Plate design, 8, can withstand solvent washing
PCB inspection contents: ① appearance inspection: ② size measurement: ③ furnace temperature test: ④ pad welding force test: ⑤ Check the PCB board factory report
When the welding ends or pins of components are oxidized or contaminated, welding defects such as poor wetting, virtual welding and voids will occur in reflow welding. Poor coplanar properties of components will also lead to welding defects such as virtua
The heating methods of reflow welding are generally divided into two categories: one is by the red lamp and adapted tube heater; The other type is ceramic plate, aluminum plate and stainless steel plate heater.
pcba aging test standards: 1, low temperature work, 2, high temperature work, 3, high temperature and high humidity work
Wave soldering process: Insert components into corresponding PCBA through holes → spray flux → preheat (temperature 90-110℃) → wave soldering (240-260℃) → cooling → repair welding → remove pins of excess components → check solder joints
PCBA processing and SMT processing differenceThe whole process of PCBA processing actually includes SMT patch processing. SMT patch processing is only part of the PCBA process, which literally means a wider range of processes
Then SMT patch processing plant will generally do what reliability test of PCBA board: 1, push and pull test: 2, FCT test: 3, fatigue test: 4, ICT test: 5, simulation of automobile transportation vibration test: 6, environmental test test: 7, aging test
Wiring is generally divided into three levels: one is the layout, which is the most basic requirements of PCB design, the second is to meet the electrical performance, which is the standard to measure whether the circuit board is qualified. Three is beaut
Due to the high temperature pyrolysis of the organic matter in the flux, it is difficult for the air bubbles to escape, resulting in the gas being wrapped in the alloy powder. From the process can be seen, organic matter by the heat produced by the main w