How to avoid HDI PCB design problems?
Maintain the integrity of signal transmission and prevent the "ground projectile phenomenon" caused by the division of ground wire.
Maintain the integrity of signal transmission and prevent the "ground projectile phenomenon" caused by the division of ground wire.
The preliminary preparation contains the preparatory component library and schematic diagram. Before PCB planning, the schematic SCH component library and PCB component packaging library should be prepared first.
The correct screen printing layer character placement criteria is: "no ambiguity, see stitches, beautiful and generous".
PCB board is a closed electronic device, is the electronic component of the support body, is the electronic component of the electrical joint carrier. HDI board is a high density interconnected circuit board.
If the PCB circuit board has the functional requirements and the demand to reduce the cost, Shen Yin is a good choice; With the outstanding flatness and touch of silver sinking, it is more appropriate to choose the silver sinking process.
To introduce the troubleshooting method of short circuit in PCBA processing: Open the PCB design drawing on the computer, pay attention to the IC internal short circuit, three, if found short circuit, it is recommended to take a board secant line, step by
Not paying attention to the packaging of products can bring immeasurable benefits.
Exposed to heat, humidity and pollution, it can still provide excellent electrical properties and maintain satisfactory weldability, but it will miss shine.
The first step to enter the PCB circuit board system is to set the PCB preset background, including setting the grid volume and type, cursor type, version layer reference, wiring reference, etc.
The most fundamental difference between gold plate and gold plate is that gold is hard gold (wear-resistant), gold is soft gold (not wear-resistant).
PCB=Printed Circuit Board ; PCBA=Printed Cirruit Board +Assembly.That is to say, PCB empty board through SMT, and then through the DIP plug-in of the whole process, referred to as PCBA.
Failure to provide sufficient time and effort for the PCB layout and wiring phase of the design can lead to problems in the manufacturing phase or functional deficiencies as the design moves from the digital domain to the physical reality.