PCBA is one of the basic components of electronic components, PCB it through surface assembly technology (SMT), and the whole process of DIP plug-in insertion, known as PCBA process.
The basic process composition of SMT patch processing includes: screen printing (or dispensing), mounting (curing), reflow welding, cleaning, detection, repair screen printing
Several parts of the circuit board are mainly: 1. Bare copper plate: 2. Gold plate: 3. Spray tin circuit board: 4. OSP process board is also called organic welding film in SMT factory.
In the future, the application of KPI will become more and more important and will become an objective basis for the improvement and evaluation of intelligent manufacturing related projects.
From PCB design to the completion of welding of all components into a high quality circuit board, PCB design engineers and even the level of welding process, welding workers and many other links have strict control.
The size of electronic devices is also getting smaller, which requires that the heat dissipation device itself should have certain heat dissipation conditions, and the heat dissipation device itself should also have certain heat dissipation conditions.
Engineers in the whole process of PCB design, in order to save time all want to ignore the table bottom of the whole board laying copper this link.
In the process of PCB production, the physical and chemical properties of each material are different, and the thermal stress residual generated in the pressing process leads to the bending and warping of the board.
Because the copper plating is not satisfied, the hole inside is empty, so it can not be directly punched on the above, to stagger a certain distance, and then hit a layer of empty.
Waste PCB board environmental protection recycling line is not only in each production link, each process in strict requirements, even every detail carefully pondering.
One of the important criteria for determining the requirements for recycling components is to know how to place components on the next board. One of the final standards is the type of component packaging required.
Lead and bromine are the hottest topics right now. Lead-free halogen will affect the development of PCB in many ways.
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