In the aspect of PCB analysis, it is mainly used to measure the thermal stability or thermal decomposition temperature of PCB materials. If the thermal decomposition temperature of the substrate is too low, PCB will explode or delamination failure phenome
In high-speed logic and circuit design, for some key signals, such as clock, control signals, to add the source end matching resistance, so that the signal will be reflected back from the load end, because the source impedance matching, the reflected sign
The optical method uses scanning to find defects in each layer, and the electronic test usually uses a flying probe to check all connections. Electronic tests are more accurate at finding short or open circuits, but optical tests can more easily detect in
When designing PCB, how to avoid errors: first, data input stage, second, post-layout inspection stage, third, post-wiring inspection stage
Here are several circuit board surface treatment is currently more common process, I can only say that there is no the most perfect surface treatment, so there are so many choices, each of the surface treatment has its own advantages and disadvantages, th
Image of local separation caused by local expansion between layers of substrate or between substrate and conductive foil or between substrate and protective coating.
How to improve PCB wiring level: 1, common ground processing of digital circuit and analog circuit, 2, signal wiring on the electrical (ground) layer, 3, connection leg processing in large area conductor, 4, role of network system in wiring, 5, power supp
Brief description of SMT patch processing and manufacturing preparation: 1. Engineering, II. Production SMT patch processing: III. Quality, four. Current process: five. New process (optimization)
PCB design engineers need to master a wide range of knowledge system, including electrical theory, component performance, digital circuit and analog circuit, PCBA processing process and DFM manufacturability theory, schematic drawing and Layout.
in fact, no matter how to produce or design, ultimately can not be separated from the consideration of money, so should all the factors into the amount to make the final measurement standard to choose a suitable plate method.
Scan the circuit board, record the location of the components in detail, disassemble the components to make a bill of materials and arrange material purchase, and scan the empty board into pictures to process and restore the PCB board drawing file.
What are the specifications of Mark processing steps: 1. The processing method of Mark, whether Mark is needed, which side of the template, etc. 2. Which side of the template Mark graphics should be placed according to the specific structure of the printi
