The technology and material problems of PCBA solder - free pressing - in connection
The key factors of PCBA crimping technology are as follows: (1) crimping end; ② Printed board; ③ crimping process; (4) Crimping tools and equipment
The key factors of PCBA crimping technology are as follows: (1) crimping end; ② Printed board; ③ crimping process; (4) Crimping tools and equipment
In order to meet customer requirements, the circuit board must plug holes through the hole, after a lot of practice, change the traditional aluminum sheet plug process, with white mesh to complete the circuit board surface welding and plug holes.
General circuit board production will be carried out board work, its purpose is to increase the production efficiency of SMT production line.
According to the activity of flux, it can be divided into active (RA), medium active (RMA), inactive (R), water washing (OA), no cleaning (NC)
5 PCBA processing automation production of PCB size, shape, transmission edge, positioning hole, positioning symbol requirements.
In the process of electronic machining, the smaller the Angle of the scraper affects the vertical force of the solder paste, the greater the vertical component of the force.
Significance of PCB cleaning after surface mounting welding: 1. PCB cleaning after surface mounting welding can prevent the occurrence of electrical defects. 2. PCB cleaning after surface mounting and welding can eliminate corrosive substances. 3. The PCB
Different welding resistance film due to the composition, content is different, and coating bonding force is not consistent, so the adhesion degree of coating and printed board welding resistance film and coating molecular polarity is closely related to t
To provide you with effective skills to improve PCB design spread rate and design efficiency: 1, determine the number of PCB layers, 2, design rules and restrictions, 3, component layout, 4, fan out design, 5, manual wiring and key signal processing, 6, a
One of the major trends of PCB design is gradually inclined to open source hardware mode and control system, another is the explosive growth of development board, PCB design tools are now being used in more and more development board design.
In the aspect of PCB analysis, it is mainly used to measure the thermal stability or thermal decomposition temperature of PCB materials. If the thermal decomposition temperature of the substrate is too low, PCB will explode or delamination failure phenome
In high-speed logic and circuit design, for some key signals, such as clock, control signals, to add the source end matching resistance, so that the signal will be reflected back from the load end, because the source impedance matching, the reflected sign