The high frequency circuit should be grounded in series at multiple points, the ground should be short and rented, and the high frequency element should be surrounded by a large area of grid foil as far as possible.
The large current of the driver chip comes from the consumption of the driving power MOS tube. The simple calculation formula is I=cvf.
Their positioning is clear and their customer groups are very stable. Generally, they do not accept factory orders, because they are not short of orders at all.
In the semiconductor electronics industry, if you want to become a qualified electronic, in addition to understanding the basic knowledge, but also know the key points of circuit protection device selection.
In the design process, most of the design can be modified to add or subtract components through prediction.
In the era of industrialization surplus, circuit board manufacturers in particular, choose a suitable circuit board manufacturers is very important! In the industry.
I replaced the suspicious chip through a wave of detection and investigation. It was determined that a component on the side of the south bridge chip was short-circuited.
There is a limit to how many circuits you can fit on a board. PCBS themselves have a size upper limit for manufacturing equipment and standard panel size reasons.
The rapid development of the electronics industry, the increasing demand for PCB (printed circuit board) manufacturing industry, including the rising board layer, the increasing tracking density and the thinning inner layer, all of which are leading to th
The default value is 16MB, which is defined in the network driver. The master device is responsible for allocating shared storage areas to other processors and for memory mapping.
PCB design must meet the requirements of SMT equipment, otherwise it will affect the production efficiency and quality, and may even be unable to complete automatic SMT by computer.
First, clean the cured photosensitive film on the PCB. It is then cleaned of excess copper foil covered with a strong alkali. The tin coating on PCB layout copper foil is then removed with destin solution. After cleaning, complete the 4-layer PCB layout.
