Width and spacing of printed wire are important design parameters, which affect not only the electrical performance and electromagnetic compatibility of PCB board, but also the manufacturability and reliability of PCB board.
The performance index of high frequency circuit directly affects the quality of the whole product. The layout and wiring of components can maximize the performance index of the circuit and achieve the design purpose of anti-interference.
Circuit board design and production process: 1. Preparation of production materials, 2. Circuit board production and manufacturing, 3. Production and design
Preliminary work to be done before PCB design :1, determine the number of PCB layers, 2, PCB design rules and restrictions, 3, component layout
How to do electromagnetic compatibility design :1. Suitable wire width,2. Key points of component wiring,3. Wiring rules for high frequency and high speed signals
Printed Circuit Board Quality Standards and Performance Specifications Series Manual. Includes the quality standards and performance specifications set by the Printed Circuit Board Association of America for all printed circuit boards.
Many customers will require the production of halogen-free board, halogen-free board is an environmentally friendly material, halogen-free circuit board is used by the substrate is processed with halogen-free raw materials.
In the study, it is found that PCB design mainly has four aspects of interference: power supply noise, transmission line interference, coupling and electromagnetic interference
The public power cables and ground cables on the two-sided SMB should be placed near the edge of the SMB and on both sides of the SMB. The power layer and ground cable layer can be installed at the inner layer of the multi-layer SMB, and the cables, power
PCB layout skills: 1, arrange the position of each functional circuit unit according to the circuit flow, so that the layout is convenient for signal flow, and make the signal as far as possible to maintain the same direction, 2, the core components of ea
Common mistakes in PCB design process are summarized as follows: 1. Pad overlap; 2. Non-standard use of graphic layer; 3. Characters unreasonable, 4. Single side pad set aperture, 5. Use filler block to draw pad, 6. The electric stratum is designed with b
Intercept the defective devices before welding to avoid the increase of maintenance cost and scrap risk after the defective mounting devices enter reflow welding.
