Based on years of actual production experience and service experience, Now on the circuit board of copper plating surface foaming causes do a brief analysis, hope to help the industry peers!
The signal line of low power should not be directly paved, and the welding plate must be directly paved through the high current. Whether it's a right Angle or a 45 degree Angle is beautiful.
The insulating substrate may be polyimide, polyethylene terephthalate, arylamide fiber ester and polyvinyl chloride.
Polyester, glass fiber, polymer material, aluminum sheet, steel sheet, etc. Reasonable design of the position, area and material of the reinforced plate has great effect on avoiding FPC tearing.
the gold plating process is more expensive than the gold plating process (higher gold content), so there are still a lot of low cost products using the gold plating process (such as remote control board, toy board).
In addition to the gold-plated copper foil at the lower left corner in the figure above, BGA packaging also uses the missing corner and concave points and silk screen dots to indicate the direction of the first foot.
Silver immersion does not have the good physical strength of electroless nickel/gold plating because there is no nickel underneath the silver layer. In addition, silver immersion has good storage, after several years of assembly will not have a big proble
Pin tin absorption can also be reduced by a flux with a slower wetting rate and a higher active temperature, or by a solder paste with different proportions of Sn/Pb to block melting.
the current motherboard, memory and graphics card and other equipment "gold finger" is almost all made of tin material, only part of the high performance server/workstation accessories contact point will continue to use gold plating, the price i...
Otherwise, you may be forced to make modifications and redesign your PCB stack structure.
Although both microstrip line and GCPW can be modeled and simulated to predict circuit performance, GCPW is more difficult to process and affected by processing at 77GHz frequency.
these changes in Dk will introduce certain impedance errors when designing millimeter-wave transmission lines using computer simulation software.
