Notice When the laser holes and the inner buried holes are inserted together, that is, the holes of the two drilling belts are in the same position, you need to move the laser holes to ensure electrical connection.
A persistent semiconductor shortage is rapidly snowballing into a full-blown component shortage, underscoring the fragility of the current supply chain.
as PCB substrate epoxy resin (see the column of PCB substrate resin chapter), PCB substrate reinforcement materials, copper foil and other manufacturing technologies have not realized commercial production.
This will break the solder joints, bend the shape of the board, or it may cause the copper thread on the board to break.
It is important to note that the power layer should be near the layer that is not the main component plane, because the bottom plane will be more complete. Therefore, EMI performance is better than the first scheme.
Choose as large a component as possible when designing the power resistance, and adjust the layout of the printed board to allow enough space for heat dissipation.
Do PCB board with the rapid development of semiconductor, each product may exist in the processing process and requirements of the difference, not to mention our production conditions may with time,
Peel off the bad part of the copper wire to see the copper foil surface, you can see the normal color of the copper foil surface, there will be no bad side erosion, copper foil peeling strength is normal.
Connectivity through holes For multi-layer circuit boards to conduct connectivity tests, the purpose is to find out whether the PCB graphics have connectivity.
In the process of board making, there are several processes to go through the yellow light room. The visual effect of green in the yellow light room is better, but this is not the main.
Some do not notice this phenomenon, directly adjust the sense resistance or working frequency to reach the required current, which may seriously affect the service life of LED.
These products and solutions can be applied to mobile devices such as smartphones, tablets and wearables, as well as high-speed data communication devices.
