How to effectively control the cost of PCBA OEM?
PCBA proofing knowledge: 1.PCBA component installation, 2.PCBA testing, 3.PCBA assembly, 4.PCBA audit
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How to prevent PCB board from bending and warping in back welding furnace
In PCB board backwelding furnace prone to plate bending and plate warping, we all know, so how to prevent PCB board backwelding furnace plate bending and plate warping.
PCBA OEM function, process, and related matters for attention
PCBA OEM has three main functions: 1. Assembly chip, 2. Processing, 3. test
How to improve customer satisfaction at PCBA assembly plant
How to improve customer satisfaction of PCBA assembly plant: first, PCBA assembly plant positioning, second, PCBA assembly plant operation, third, quality control of PCBA assembly plant
Microstrip wire circuit metallized through holes
Compared with the circuit material without microsphere packing, the RO4730G3 circuit material with hollow microsphere packing may form metallized pores on the surface of rough pore wall.
A brief history and development direction of PCB
Printed circuit board A flat plate made of non-conductive material, usually with pre-drilled holes designed to hold chips and other electronic components. The holes of the components help to connect the pre-defined metal paths printed on the surface of th
Analysis of reasons and countermeasures for PCB size expansion and shrinkage
By analyzing the causes of PCB size increase and contraction, we can find out the available monitoring and improvement methods.
PCB proofing industry reshuffle is nonsense small factory break through to quality is king
Returning to the PCB proofing market, price is the first indicator for customers to choose products, but in the future, with the gradual standardization of PCB industry standards, it will be difficult to attract repeat customers by relying on low price an
PCB engineering design requirements
The shelf life of PCB made by OSP process and pure gold sinking process is generally 6 months after packaging. Baking is not recommended for OSP process.
Analysis of copper exposure in the process of hot air leveling printed circuit board
Hot air smoothing is to dip the printed circuit board into the molten solder (63SN/37PB), and then use the hot air to blow off the excess solder on the surface of the printed circuit board and in the metallized hole, to obtain a smooth, uniform and bright
Recent development trend of PCB technology in electronic field
The domestic leading automobile board represented by Shanghai Electric Company has actively participated in international cooperation and introduced advanced technology. The high-frequency PCB used for millimeter wave radar has been mass-produced.
PCB industry prosperity is improving
The size of the welding nozzle should be as large as possible to ensure the stability of the welding process and not affect the adjacent components on the PCB, which is important to the design engineer, but also difficult, because the stability of the pro
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