What samples should be provided for PCB circuit board proofing? The quotation information needs to be provided to the manufacturer, and the GEBER file is generally provided for the drawings. There are clear process requirements and quantity. The pcb manuf
PCBA processing needs to do three requirements: first, the solder paste, must be stored in 5-10 degrees of environment. In order not to affect the use of solder paste, shall not be placed in the environment below zero, second, in the process of SMT proces
To improve the pass rate of SMT patch processing, the following five process optimization methods are required :1. Improved pcb circuit board steel mesh design;2. Select the appropriate solder paste type; 3. Improve the printing process operation method;
SMT patch processing for the requirements of flux: 1. The appearance of the flux should be uniform, transparent, no foreign matter. 2 viscosity and density than molten solder is small, 4 melting point than solder is low, 5 welding does not produce welding
Board explosion caused by water absorption accounted for 70% of the defects, other reasons such as PCB structure uneven growth and contraction, cold and heat imbalance, process injury and bad blackening.
In PCB proofing, the copper foil part is pre-coated with a layer of lead tin anticorrosive layer, which remains in the outer layer of the board, that is, the graphic part of the circuit, and then the rest of the copper foil is chemically etched, known as
The silk screen position number does not determine whether the final patch is correct. Many experienced engineers found that deleting the bit number silk screen printing, PCBA product patch back and no problem. Generally, the machine patch locates the dev
In PCBA manufacturing, automatic optical detection is set at the last step of the SMT production line. After the SMT patch processing is completed, product defect detection is required. Through timely detection and reduction of defects, improve assembly e
The welding methods of PCBA: (1) split welding method: (2) centralized welding method: (3) residual welding method: (4) shear welding method
SMT patch processing refers to the process of pasting electronic components and other materials on PCB bare board. It is a popular processing technology in electronic assembly industry.
Small batch PCB proofing charge is high, mainly in SMT SMT processing, whether large batch SMT processing, small batch SMT processing, need to do the preliminary work is the same
PCBA proofing processing common production procedures :1. Repair: 2. Mounting: 3. Testing: 4. Curing: 5. Cleaning: 6. Solder paste printing: 7. Reflow welding: 8. dispensing
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