Development of substrates for printed circuit boards
HDI board technology is characterized by BuildingUpProcess, commonly used resin coated copper foil (...
HDI board technology is characterized by BuildingUpProcess, commonly used resin coated copper foil (...
The characteristics of PCB splicing machine and stable operation mechanism, prevent improper externa...
In the design of PCB board, PCB anti-ESD design can be realized by layering, proper layout and wirin...
In PCB circuit design, the coupling between differential routing is generally small, often accountin...
At the same time, acidic copper plating process is widely used because of its simple solution basic ...
brush roller suction stick pollution glue stains, blow-dry drying section of wind knife fan viscera,...
Copper plating is the most widely used in order to improve the adhesion of the coating and a kind of...
PCB board conductive circuit pattern is not balanced or PCB board two sides of the circuit is obviou...
On pre-tinned PCB, the porosity of BGA joint increases with the increase of solvent volatility, meta...
Electronic Components Procurement SummaryThe premise of purchasing is to understand and be familiar ...
Multi-layer PCB production processCompared with the particle board, the two most obvious advantages ...
The use and advantages and disadvantages of high density boardHigh-density board is a very common de...