What are the main challenges of 5G communication to PCB process?

What are the main challenges of 5G communication to PCB process?

PCB manufacturers, PCB designers and PCBA manufacturers explain to you the main challenges of 5G communication to PCB technology?

5G communication has an increasing impact on people's lives, and the newly developed mobile phones will step into the 5G era bit by bit. Let's take a look at what challenges 5G communication has brought to PCB industry!

Requirements for materials: A very clear direction of 5G PCB is high-frequency high-speed materials and board making. In terms of high-frequency materials, it is obvious that material manufacturers in traditional high-speed fields, such as Lianmao and Panasonic, have begun to lay out high-frequency plates and launched a series of new materials. This will break the dominance of Rogers in the field of high-frequency plates. After benign competition, the performance, convenience and availability of materials will be enhanced. Therefore, the localization of high-frequency materials is an inevitable trend.

Requirements for quality monitoring: due to the improvement of 5G signal rate, the influence of plate making deviation on signal performance becomes greater, which requires more strict control of plate making production deviation. However, the current mainstream plate making process and equipment are not updated, which will become the bottleneck of future technology development. It is very important for PCB manufacturers to break the situation.

Requirements for manufacturing process: The functional improvement of 5G related application products will increase the demand for high-density PCB, and HDI will also become an important technical field. Multi stage HDI products and even products interconnected in any order will be promoted, and new technologies such as buried resistance and buried capacity will be applied more and more.

The uniformity of copper thickness, the degree of line width, the inter layer alignment, the thickness of the interlayer medium, the control accuracy of the back drilling depth, and the ability of plasma to remove the dirt are worthy of in-depth study.

Requirements for PCB design: the selection of boards should meet the requirements of high frequency and high speed, and the impedance matching, stacking planning, wiring spacing/holes should meet the requirements of signal integrity, specifically from the loss, embedding, high frequency phase/amplitude, mixed pressure, heat dissipation, PIM.

Requirements for equipment and instruments: high-precision equipment and pretreatment line with less copper surface roughening are ideal processing equipment at present; The testing equipment includes passive intermodulation tester, impedance tester, loss testing equipment, etc.

Precise graphic transfer and vacuum etching equipment, line width and coupling distance detection equipment that can monitor and feedback data changes in real time; Electroplating equipment with good uniformity and high-precision laminating equipment can also meet the production requirements of 5G PCB. PCB manufacturers, PCB designers and PCBA manufacturers explain to you the main challenges of 5G communication to PCB technology?