Kingford focus on the high-quality PCBA order demand of "Multiple varieties, medium and small batch, and short lead time".
PCBA processing and SMT processing differenceThe whole process of PCBA processing actually includes SMT patch processing. SMT patch processing is only part of the PCBA process, which literally means a wider range of processes
The following are four ways to ensure the quality of PCBA processing: 1. Quality control, 2. Inspection and testing, 3. Use high quality raw materials: 4. Professional technical team
Ways to improve SMT machining efficiency: (1) Aim for fewer component changes, (2) Focus more on PCBA assembly, (3) You should know every step of the SMT process
Core and key points of SMT process: The goal of SMT process is to produce qualified solder joints. A good solder joint depends on the right pad design, the right amount of solder paste and the right reflow temperature curve
Here are some possible reasons for potential growth: 1. PCB solder resistance details; 2. Surface treatment; 3. Screen printing; 4. Impedance details: 5
Classification of PCBA inspection items: inspection items are divided into four categories: material inspection, process inspection, identification inspection and quality consistency inspection
PCBA proofing processing common production procedures :1. Repair: 2. Mounting: 3. Testing: 4. Curing: 5. Cleaning: 6. Solder paste printing: 7. Reflow welding: 8. dispensing
In terms of the overall process capability of SMT today, the solder paste printing ability is the worst. Because the solder paste printing more or less or the printing offset are related to the quality of the solder behind, it is the most need to be speci
In the SMT process of the PCB manufacturer, the solder paste printing, the operation of the SMT machine, and the welding of the reflow welding furnace should be listed as the key processes.
The rapid development and popularization of SMT processing has played a unique role in promoting the development of modern information industry.
The main reasons for poor wetting are: 1, the surface of the welding area is polluted, 2, when the residual metal in the solder exceeds 0.005%, the activity of the flux is reduced, 3, wave soldering, there is gas on the surface of the substrate,
Component layout shall be designed according to SMT electronic processing production equipment and process characteristics and requirements. Different processes, such as reflow welding and wave soldering, have different layouts for components.
