Common mistakes in PCB design process are summarized as follows: 1. Pad overlap; 2. Non-standard use of graphic layer; 3. Characters unreasonable, 4. Single side pad set aperture, 5. Use filler block to draw pad, 6. The electric stratum is designed with b
PCBA batch processing success of the four secrets: one, planning in advance, two, looking for suppliers, three, evaluation of capacity and capacity, four, trust your suppliers
There are five common principles in PCB design: component arrangement rules, according to the signal direction layout principle, electromagnetic interference prevention principle, thermal interference suppression principle, adjustable component layout pri
PCBA processing requirements for PCB board; 1, PCB size,2, PCB board side width,3, PCB bending,4, PCB board Mark point,5, PCB welding pad
The process process of PCBA can be roughly divided into four main links: SMT patch processing →DIP plug-in processing →PCBA testing → finished product assembly
This confusion has always existed in norms, standards, discussions, and documents. People think of stability tests as reliability tests, when in fact they are durability tests.
These Tier 1 suppliers have decades of experience in the automotive sector, and given that they are ultimately financially responsible for reliability, they do a lot of work in modeling.
This applies not only to the interconnection and isolation of circuit boards, but also to the high frequency testing of circuit boards, because the material will change its electrical characteristics after undergoing the component welding process.
According to the welding pad surface treatment classification: organic weldability protection layer (OSP), nickel metal leaching (ENIG), nickel palladium leaching (ENEPIG), silver Immersion silver, tin immersion.
Laser marking technology, as a modern precision machining method, has unparalleled advantages compared with traditional machining methods such as machine labeling, manual labeling, inkjet coding and printing.
the industry of hot air reflow welding technology generally relies on two technologies: furnace temperature tester and real-time monitoring system.
Intercept the defective devices before welding to avoid the increase of maintenance cost and scrap risk after the defective mounting devices enter reflow welding.
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