Not only in the PCB board copy process, is in the circuit maintenance, often need to remove the integrated circuit from the printed circuit board, and because the IC pins are more and more dense, it is difficult to disassemble, sometimes will damage the i
PCB copying board from reverse research to break foreign technology monopoly and control, and core technology digestion and absorption and re-innovation, or can improve the level of core technology localization.
For some basic electronic circuit framework and schematic method, engineers need to master, not only to be able to draw some simple and classic basic cell circuit composition form directly, but also to form the overall framework of electronic circuit.
Wiring rules for high speed PCB boards with four or more layers.PCB version is divided into many layers, which high four layers of wiring skills, the following for you to introduce, I hope to help you.
At present, electronic and digital products, automobiles, medical products and other products such as circuit board production requirements for the process and speed is relatively strict
The process of PCB resin plugging includes drilling, electroplating, plugging, baking and grinding. After drilling, the hole will be plated through, and then the resin will be plugged and baked.
usually higher than the solder melting point (183°C)50°C~60°C in most cases refers to the temperature of the solder furnace actual operation, the welded PCB solder joint temperature is lower than the furnace temperature, this is because of the PCB heat ab
SMT processing plant should first establish and check the anti-static basic engineering, such as ground wire, floor mat, table integration, environmental anti-static Wang project
In the layout of circuit modules, on the one hand, it is necessary to pay attention to the clock circuit and crystal oscillator circuit to reach the target through the shortest path.
The thickness of PCB board should be determined according to the function of PCB board, the weight of the mounting components, the specifications of PCB board socket, the outline size of PCB board and the mechanical load to be borne.
In order to suppress the cross talk between the printed circuit board wires, in the design of wiring should be as far as possible to avoid long distance equal wiring, as far as possible to open the distance between lines, signal lines and ground and power
The severe shrinkage of PCB parts after the transfer of the outer pattern caused by the poor dimensional stability of PCB substrates in individual batches can only be detected by the measurement of the outer pattern production first plate or during the sh
