CAPABILITIES IN MILITARY PCB ASSEMBLYMilitary Grade PCB assembly need to be robust enough to comply with the harsh conditions it needs to function in. That calls for the following:Specific layout techniques100% Design-for-test coverageThermal Managem
The PCB processing factory explains PCB design, high-speed backplane design and PCB layout skills, and uses backplanes to arrange these boards and cascade them.
The PCB processing factory explained how to avoid common PCB design errors and correctly handle all design errors at the first time.
The PCB processing factory explained the method to improve the iteration speed of PCB design prototype and the PCB development process.
The explanation engineer of the circuit board processing factory explained and analyzed the design of the RF PCB circuit board in detail, and the balance transformer was useful.
The PCB processing factory explains the PCB material properties, PCB substrate, conductor and component material properties that should be considered when designing the circuit board.
The PCB processing factory explained the thermal hysteresis of the voltage reference caused by PCB design, and what is the thermal hysteresis.
The circuit board processing factory explains the electronic product design steps, preliminary production design, schematic diagram, PCB layout, final BOM, prototype, test and procedure, and final certification of pcb design
The circuit board processing factory explained that the engineers shared the skills of using new parts to update the old PCB design
The PCB processing factory explains the effective chassis grounding technology, chassis grounding and chassis grounding in PCB design.
The PCB processing factory explains the single point grounding and multi-point grounding in PCB layout, and the knowledge needed to know when connecting grounding in the next layout.
The PCB processing factory explained how to use the reliability design (DfR) principle to optimize PCB and solve the fault point before the actual problem occurs.
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