The FPC board is soft and not vacuum packed when leaving the factory. It is easy to absorb moisture in the air during transportation and storage. It needs to be pre-baked before SMT line casting to slowly force out the moisture.
Now there are many companies or individuals that recycle electronic materials. They use various channels to recycle these electronic materials in the market, although the recycling of electronic materials is a good way to save social resources.
There are many kinds of PCB substrates, but they are generally divided into two categories, namely inorganic substrate materials and organic substrate materials.
Software vendors and third-party engineers have also tried and failed to achieve acceptable performance improvements.
through the titanium electrode rolling plating method to carry out the first and second rolling plating, improve the thickness of the copper layer to enhance the actual effect of the conductivity of the guide hole.
The application of wave-crest welding technology and reflow welding technology are completely different in component layout design, PCB and pad graphic design and hole design.
In PCB processing and production, static electricity is not the hazard, the real danger lies in the accumulation of static electricity, and the resulting electrostatic discharge.
In the process of production, packaging and transportation, and the processing, debugging and testing of the integrated machine, it is inevitable to suffer from external or own friction and form a high surface potential.
How to route the key signals of PCB design: first, analog signal wiring requirements, second, high-speed signal wiring requirements, third, clock signal wiring requirements
Four characteristics of PCB gold sinking process: 1. Gold sinking plate bright color, good color, beautiful, enhance the appeal to customers. 2. The crystal structure formed by sinking gold is easier to weld and has better performance to ensure the qualit
The influence of human factors on manual welding of soldering iron is more. Machine welding, once the process parameters are adjusted, the production is very stable, but there are problems of welding temperature and welding time in manual welding.
According to the requirements and requirements of failure analysis, it is necessary to adopt various analysis techniques and methods to determine the location of failure, the degree of failure, the cause and mechanism of failure.
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