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PCBA process and SMT placement parts and components data
04Dec
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PCBA process and SMT placement parts and components data

PCBA process and SMT placement parts and components data
PCBA patch processing technology
PCBA process:
1. PCBA processing single-sided assembly process: solder paste printing patch reflow;
2. PCBA processing double sided surface assembly process: A side printing solder paste patch reflow soldering clip board B side printing solder paste patch reflow soldering;
3PCBA processing single side mixed assembly (SMD and THC are on the same side): solder paste printing paster reflow soldering manual parts (THC) - wave soldering;
4. Single side mixed packaging (SMD and THC are located on both sides of PCB respectively): B-side printed red adhesive patch red adhesive curing - slap-A side welded piece - B-side wave soldering;
5. Double side mixing devICe (THC is on side A, and there are patches on both sides of A and B): A side printed solder paste patch reflow soldering flip plate B side printed red adhesive patch red adhesive curing flip plate A side printed pieces B side wave soldering;

PCBA

6. Double sided mixed packaging (SMD and THC on both sides of A and B): A side printing solder paste - patch reflow soldering flip plate B side printing red glue - patch red glue curing flip plate A surface sealing piece B side wave soldering B side sealing piece.
During welding, the SMAllest variable shall belong to machinery and equipment, which shall be checked first. In order to achieve the correctness of the inspection, independent electronic instruments can be used for assistance, such as thermometer to detect various temperatures, and electricity meter to accurately calibrate machine parameters.
Advantages of SMT anti sticking parts and parts data
In SMT chip processing, the most commonly used components are chip data and chip data, each of which has its own advantages. Due to the advantages of miniaturization and precision, Surface Mount Technology occupies an increasing share in electronic processing, and the components most used in surface mount casting materials are wafer components. Compared with plug-in components, SMT anti patch components are small in size and low in cost, but plug-in components also have their own advantages, such as stable performance, good heat dissipation, and better anti vibration performance.
Compare the advantages of SMT anti patch material and SMT anti patch material.
SMD data components:
1. The solder joint defect rate is low.
2. High reliability and strong anti vibration capability.
3. Good high frequency characteristics, reduce electromagnetic and radio frequency interference.
4. Light weight: the weight of patch assembly is only 10% of that of traditional DIP components. Generally, the weight is reduced by 60% - 80% after using surface mount technology.
5. Small size: the volume of SMT chip proofing module is only about 10% of that of traditional DIP chip modules. In general, after SMT chip proofing, the volume of electronic products is reduced by 40% - 60%.
6. Low cost: chip processing is easy to automate, improving production efficiency, saving data, energy, equipment, manpower, time, etc., and reducing costs by 30% - 50%.
Advantages of components:
2. The failure rate of components is lower than SMT anti sticking, which is more convenient for inspection.
1. When electronic products with high heat dissipation requirements are used, the performance of plug-in components will be superior to the chip data processed by SMT, because the heat dissipation effect of plug-in data is very good compared with the chip components. The use of packaging materials processed by pieces in SMT work will have a better impact on the stability and efficiency of products.
3. The stability of the parts will be better when facing turbulence and vibration in extreme environments Different components have different advantages This requires engineers to comprehensively consider and select appropriate components in the electronIC design stage to achieve the best design effect SMT processing
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