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PCB surface

PCB surface treatment process OSP advantages and disadvantages

An OSP circuit board, exposed to the air for more than ten days, will not be able to weld components. Energy production from 2 layers to 14 layers, 14-22 layers can be proofing production.Minimum line width/spacing: 3mil/3milBG Distance :0.20MM Minimum ap

PCB surface treatment technology

In the deposition process, phosphorus is co-deposited with nickel into the coating, and the chemical precipitation of nickel is actually a chemical precipitation of nickel-phosphorus alloy.

Characteristics, application and development trend of PCB surface treatment technology

With the continuous progress of human requirements for living environment, the environmental problems involved in the production process of PCB are particularly prominent.

Advantages and disadvantages of different PCB surface treatments

There are many kinds of surface treatment of the circuit board. PCB proofing personnel should choose according to the performance and requirements of the board.

Characteristics, applications and development trend of common PCB surface treatment processes

Therefore, electroless nickel plating/gold leaching is to coat the copper surface with a thick layer of good electrical nickel gold alloy, which can protect the PCB for a long time; In addition, it has environmental tolerance that other surface treatment

Eight kinds of PCB surface treatment technology

the environmental problems involved in PCB production are particularly prominent. The topic of lead and bromine is the hottest, lead-free and halogen-free will affect the development of PCB in many ways.

How to choose PCB surface treatment process?

The results show that the latest organic coating technology can maintain good performance in multiple lead-free welding processes.

Use and development trend of PCB surface treatment

The choice of surface treatment process mainly depends on the type of final assembly components; The surface treatment process will affect PCB production, assembly and final use.

PCB surface treatment process characteristics

The purpose of the surface treatment is to ensure good solderability or electrical properties. Since copper tends to exist in the air as an oxide and is unlikely to remain as raw copper for long periods of time, other treatments of copper are required.

The advantages and disadvantages of common PCB surface treatment technology

The OSP acts as a barrier between the copper and the air. Simply put, it chemically grows an organic film on a clean, bare copper surface. The only function of this organic film is to ensure that the inner copper foil does not oxidize before welding.

Influence of PCB surface treatment technology on SMT welding quality

The PCBA project should be completed in seven steps: first, preliminary preparation stage, second, design and development, third, design and editing of operation instruction of SMT production process, fourth, confirmation of steel mesh production ability,

How to distinguish PCB surface treatment process by color?

PCB surface treatment process is identified by color: 1, gold, 2, silver, 3, light red

Just upload Gerber files, BOM files and design files, and the KINGFORD team will provide a complete quotation within 24h.