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With the continuous progress of human requirements for living environment, the environmental problems involved in the production process of PCB are particularly prominent.
There are many kinds of surface treatment of the circuit board. PCB proofing personnel should choose according to the performance and requirements of the board.
Therefore, electroless nickel plating/gold leaching is to coat the copper surface with a thick layer of good electrical nickel gold alloy, which can protect the PCB for a long time; In addition, it has environmental tolerance that other surface treatment
the environmental problems involved in PCB production are particularly prominent. The topic of lead and bromine is the hottest, lead-free and halogen-free will affect the development of PCB in many ways.
The results show that the latest organic coating technology can maintain good performance in multiple lead-free welding processes.
The choice of surface treatment process mainly depends on the type of final assembly components; The surface treatment process will affect PCB production, assembly and final use.
The purpose of the surface treatment is to ensure good solderability or electrical properties. Since copper tends to exist in the air as an oxide and is unlikely to remain as raw copper for long periods of time, other treatments of copper are required.
The OSP acts as a barrier between the copper and the air. Simply put, it chemically grows an organic film on a clean, bare copper surface. The only function of this organic film is to ensure that the inner copper foil does not oxidize before welding.
The PCBA project should be completed in seven steps: first, preliminary preparation stage, second, design and development, third, design and editing of operation instruction of SMT production process, fourth, confirmation of steel mesh production ability,
PCB surface treatment process is identified by color: 1, gold, 2, silver, 3, light red
Most copper crepe will occur in areas where the line density is different, especially where one side is designed to be large copper but the other side has a large empty area.
According to the activity of flux, it can be divided into active (RA), medium active (RMA), inactive (R), water washing (OA), no cleaning (NC)