To improve the pass rate of SMT patch processing, the following five process optimization methods are required :1. Improved pcb circuit board steel mesh design;2. Select the appropriate solder paste type; 3. Improve the printing process operation method;
SMT patch processing for the requirements of flux: 1. The appearance of the flux should be uniform, transparent, no foreign matter. 2 viscosity and density than molten solder is small, 4 melting point than solder is low, 5 welding does not produce welding
SMT patch processing refers to the process of pasting electronic components and other materials on PCB bare board. It is a popular processing technology in electronic assembly industry.
SMT patch processing common detection methods: 1, optical detection method, 2, artificial visual detection method, 3, AOI detection method
SMT patch processing common materials: 1, patch resistance, 2, patch capacitor, 3, induction coil, 4, transformer, 5, crystal diode, 6, field effect transistor
SMT processing plant plays an important role in the electronic processing industry, which is indispensable for the precision and miniaturization of electronic products
SMT patch processing main characteristics: 1, high density: 2, small aperture: 3, low coefficient of thermal expansion: 4, high temperature resistance performance:
Manual welding methods for SMT patch processing of leadless chip components: one by one welding spot, two, using special tools horseshoe iron head welding, three, using flat chip iron head quick welding
The emptiness is mainly caused by the following reasons: first, welding paste. Two, PCB welding pad surface treatment. Three, reflux curve setting. Four, reflux environment. Five, pad planning. Six, micropores.
Key parameters of reflow welding equipment :1. Number, length and width of temperature zone; 2. Symmetry of upper and lower heaters; 3. Uniformity of temperature distribution in the warm zone; 4. Independence of transmission speed control in temperature i
The reasons for component displacement in patch processing are as follows: 1, the use time of solder paste is limited, 2, the solder paste itself is not sticky enough, 3, the flux content in solder paste is too high, 4, in the process of printing and patc
In the SMT process, there are six mounting quality problems that need attention: 1, mount design quality, 2, mount raw materials (components, PCB, welding paste and other mount materials) quality, 3, mount process quality (process quality), 4, mount weldi
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