Kingford focus on the high-quality PCBA order demand of "Multiple varieties, medium and small batch, and short lead time".


PCB manufacturing capability

Standard PCB Production CapabilityFeatureCapabilityQuality GradeStandard IPC 2Number of Layers1 - 32layersOrder Quantity1pc - 10,000,000 pcsBuild Time2days - 5weeks (Expedited Service)MaterialFR-4 Standard Tg 150°C, FR4-High Tg 170°C, FR4-High-Tg 180°C, F

Multilayer PCB Capability

Multilayer PCB Production CapabilityItemCapabilityLayer Count1-40layersBase MaterialKB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350B、Rogers4000、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/T

HDI PCB Capability

HDI (High Density Interconnect) PCB Process CapabilityItembatchTemplatelayers4-16 Layers4-24 LayersPlate thickness range0.6-3.2mm0.4-6.0mmhighest order4+N+4Any layer innterconnectedMinimum laser hole4mil (0.1mm)3mil (0.075mm)Laser processCO2 Laser Machine

PCB Capability

ItemCapabilityLayer Count1-40layersBase MaterialKB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350B、Rogers4000、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-

Thick Copper PCB Capability

Thick Copper PCB CapabilityFeatureCapabilityMaterialFR-4 Standard Tg 140°C, FR4-High Tg 170°CMin. Track/SpacingFor External layers:4oz Cu 10mil/13mil,5oz Cu 12mil/15mil6oz Cu 15mil/15milFor Internal layers:4oz Cu 8mil/8mil,5oz Cu 10mil/10mil6oz Cu 12mil/1

PCB Prototype Capabilities

PCB Prototype FeaturesCapabilityQuality GradeStandard IPC 1-3Number of Layers1 – 32layersOrder Quantity1pcs +Build Time2 – 15 daysMaterialRigid: FR2, CEM-1, CEM-3, FR4 (standard – halogen-free – high performance) including ShengYi, Iteq, Elite Materials C

PCB Assembly Capability

ItemProcess Capability ParameterOrder Quantity≥1PCQuality GradeIPC-A-610Lead Time24 hours expedited service can be offered. 3- 4 days normally for PCBA prototype orders. We will give you an accurate lead time when we quote for you.Size50*50mm~510*460mmBoa

PCB Fabrication Capability

ItemManufacturing CapabilityPCB Layers1~64 LayerQuality GradeIPC Class 2|IPC Class 3Laminate/Base materialFR-4|S1141|High Tg|PTFE|Ceramic PCB|Polyimide|S1000-2|IT180A|Isola-FR408HR|FR406|Isola 370 HR|Rogers|Taconic|Arlon|Halogen Free, etc.Brand of Laminat

PCB Assembly Capability

SMT capacity: 19 million points/dayTesting EquipmentX-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework StationPlacement speedChip placement speed (at best conditions) 0.036 S/pieceMounted Component Specif

Hefei multi-layer PCB design and development scheme

When using power rails, high voltage components, and other heat sensitive parts of the board, the PCB line width in relation to the ammeter can be used to determine the line width to use in the layout.

Hefei simple PCB design wiring

PCB designers should minimize the number of bypass capacitors, which can increase current loss. Hefei simple PCB design wiring

Overview of PCBA electrical stress test methods

Some basic testing and inspection tasks may be required to be performed on your PCB/PCBA during the manufacturing and assembly process, and it is recommended that these tests be performed, at the very least, to ensure continuity, accurate assembly, and si

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