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PCB manufacturing capability

Standard PCB Production CapabilityFeatureCapabilityQuality GradeStandard IPC 2Number of Layers1 - 32layersOrder Quantity1pc - 10,000,000 pcsBuild Time2days - 5weeks (Expedited Service)MaterialFR-4 Standard Tg 150°C, FR4-High Tg 170°C, FR4-High-Tg 180°C, F

Multilayer PCB Capability

Multilayer PCB Production CapabilityItemCapabilityLayer Count1-40layersBase MaterialKB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350B、Rogers4000、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/T

HDI PCB Capability

HDI (High Density Interconnect) PCB Process CapabilityItembatchTemplatelayers4-16 Layers4-24 LayersPlate thickness range0.6-3.2mm0.4-6.0mmhighest order4+N+4Any layer innterconnectedMinimum laser hole4mil (0.1mm)3mil (0.075mm)Laser processCO2 Laser Machine

PCB Capability

ItemCapabilityLayer Count1-40layersBase MaterialKB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350B、Rogers4000、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-

Thick Copper PCB Capability

Thick Copper PCB CapabilityFeatureCapabilityMaterialFR-4 Standard Tg 140°C, FR4-High Tg 170°CMin. Track/SpacingFor External layers:4oz Cu 10mil/13mil,5oz Cu 12mil/15mil6oz Cu 15mil/15milFor Internal layers:4oz Cu 8mil/8mil,5oz Cu 10mil/10mil6oz Cu 12mil/1

PCB Prototype Capabilities

PCB Prototype FeaturesCapabilityQuality GradeStandard IPC 1-3Number of Layers1 – 32layersOrder Quantity1pcs +Build Time2 – 15 daysMaterialRigid: FR2, CEM-1, CEM-3, FR4 (standard – halogen-free – high performance) including ShengYi, Iteq, Elite Materials C

PCB Assembly Capability

ItemProcess Capability ParameterOrder Quantity≥1PCQuality GradeIPC-A-610Lead Time24 hours expedited service can be offered. 3- 4 days normally for PCBA prototype orders. We will give you an accurate lead time when we quote for you.Size50*50mm~510*460mmBoa

PCB Fabrication Capability

ItemManufacturing CapabilityPCB Layers1~64 LayerQuality GradeIPC Class 2|IPC Class 3Laminate/Base materialFR-4|S1141|High Tg|PTFE|Ceramic PCB|Polyimide|S1000-2|IT180A|Isola-FR408HR|FR406|Isola 370 HR|Rogers|Taconic|Arlon|Halogen Free, etc.Brand of Laminat

PCB Assembly Capability

SMT capacity: 19 million points/dayTesting EquipmentX-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework StationPlacement speedChip placement speed (at best conditions) 0.036 S/pieceMounted Component Specif

Design tips for different types of PCBA manufacturing

It is important to note that the final performance rating (assembly, welding, cleaning and testing) of a PCBA cannot be higher than the performance rating specified for a bare board or prefabricated PCB. Therefore, to obtain a Class 3 PCBA, IPC Class 3 mu

Will PCBA assembly process damage PCBS?

The higher the Td, the slower the burn rate. Materials with Td equal to or below 300°C are suitable for eutectic tin-lead welding. Materials with Td above or above 300°C are more suitable for lead-free welding. In this case, the higher the Td value, the h

A collection of examples of printed circuit boards (PCBS) from professional pcba proofing manufacturers

Challenge: Equipment is expected or required to maintain as uniform surface pressure as possible to improve the quality of processed products

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