Professional PCB manufacturing and assembly
Building 6, Zone 3, Yuekang Road,Bao'an District, Shenzhen, China
+86-13410863085Mon.-Sat.08:00-20:00
| Item | Manufacturing Capability |
| PCB Layers | 1~64 Layer |
| Quality Grade | IPC Class 2｜IPC Class 3 |
| Laminate/Base material | FR-4｜S1141｜High Tg｜PTFE｜Ceramic PCB｜Polyimide｜S1000-2｜IT180A｜Isola-FR408HR｜FR406｜Isola 370 HR｜Rogers｜Taconic｜Arlon｜Halogen Free, etc. |
| Brand of Laminate | Kingboard｜ITEQ｜Shengyi｜Nanya｜Isola｜TUC｜SYL｜Arlon｜Nelco｜Taconic｜Hitachi｜Rogers, etc. |
| High Temperature Material | Normal Tg: Shengyi S1141｜KB6160｜Huazhen H140（not suitable for lead-free process ） |
| Middle Tg: For HDI、multilayers: SY S1000H｜ITEQIT158｜HuazhengH150｜TU-662｜SY S1150G｜HuazhengH150HF｜H160HF； | |
| High Tg: For thick copper、high layer: SY S1000-2｜ITEQIT180A｜HuazhengH170｜ISOLA: FR408R｜370HR｜TU-752｜SY S1165 | |
| High Frequency Circuit Board Material | Rogers｜Arlon｜Taconic｜SY SCGA-500｜S7136｜HuazhengH5000 |
| High Speed PCB Material | SY S7439｜TU-862HF｜TU-872SLK｜ISOLA: I-Speed, I-Tera@MT40｜Huazheng：H175｜H180｜H380 |
| Ink | Taiyo INK (Japan)｜KUANGSHUN(China)｜RONGDA(China)｜Coates Screen(UK)｜S.M Materials(Taiwan, China) |
| Heat Conductivity for Alu. Boards | 1.0 |
| Chemical | Rohm&Haas (US)｜Atotech (Germany)｜Umicore (Germany) |
| PCB Type and Services | Prototype PCB｜Rigid PCB｜Flexible PCB(FPC)｜Rigid-Flex PCB｜HDI PCB｜High Tg PCB｜BGA PCB｜Impedance Control PCB｜IMS PCB(LED PCB Board, Aluminum PCB, Metal Core PCB)｜Multilayer PCB｜PCBA(PCB Assembly Service) |
| Max Board Size | 609 * 889 mm |
| Board Thickness | 0.1~8.0mm |
| Board Thickness Tolerance | ±0.1mm / ±10% |
| Min base copper thickness | Outer layer:1/3oz (12um) ~10oz｜Inner layer:1/2oz~6oz |
| Max finished copperthickness | 6 OZ |
| Min Mechanical Drilling Hole Size | 6mil(0.15mm) |
| Min Laser Drilling Hole Size | 3mil(0.075mm) |
| Min CNC Drilling Hole Size | 0.15mm |
| Hole Wall Roughness（Max） | 1.5mil |
| Min trace width/spacing(Inner Layer) | 2/2mil(Outer layer:1/3oz,Inner layer:1/2oz) （H/H OZ base copper） |
| Min trace width/spacing(Outer Layer) | 2.5/2.5mil （H/H OZ base copper） |
| Min spacing between hole to inner layer conductor | 6mil |
| Min spacing between hole to outer layer conductor | 6mil |
| Min annular ring for via | 3mil |
| Min annular ring for component hole | 5mil |
| Min BGA diameter | 8mil |
| Min BGA pitch | 0.4mm |
| Min Finished hole size | 0.15mm（CNC）｜0.1mm（Laser） |
| Half Hole Diameter | Minimum Half hole Diameter: 1mm, Half hole is a special technology, so half hole diameter should be greater than 1mm. |
| Hole Wall Copper Thickness (Thinnest) | ≥0.71mil |
| Hole Wall Copper Thickness (Average) | ≥0.8mil |
| Minimum Air Gap | 0.07mm(3mil) |
| Fine SMD Pitch | 0.07mm(3mil) |
| Max aspect ratios | 20:01 |
| Min soldermask bridge width | 3mil |
| Soldermask/circuit processing method | Film｜LDI |
| Min thickness for insulating layer | 2mil |
| HDI & special type PCB | HDI（1-3 steps）｜R-FPC（2-16 layers）｜High frequency mix-pressing（2-14 layers）｜Buried capacitance & resistance … |
| Max. PTH (Round Hole) | 8mm |
| Max. PTH (Round Slot Holes) | 6*10mm |
| PTH Deviation | ±3mil |
| PTH Deviation (Width) | ±4mil |
| PTH Deviation (Length) | ±5mil |
| NPTH Deviation | ±2mil |
| NPTH Deviation (Width) | ±3mil |
| NPTH Deviation (Length) | ±4mil |
| Hole Position Deviation | ±3mil |
| Character Types | Serial Number｜Barcode｜QR Code |
| Min Character Width (Legend) | ≥0.15mm, Characters width less than 0.15mm will be unidentifiable. |
| Min Character Height (Legend) | ≥0.8mm, Characters height less than 0.8mm will be unidentifiable. |
| Character Width to Height Ratio (Legend) | 1:5, 1:5 is the most suitable ratio for production. |
| Distance between Trace and Outline | ≥0.3mm(12mil), Ship as individual boards: Distance between Trace and Outline ≥0.3mm, Ship as Panelized boards with V-cut: Distance between Trace and V-cut line ≥0.4mm |
| Panelization without Spacing | 0mm, Ship as Panelized boards and the spacing between boards is 0mm. |
| Panelization with Spacing | 1.6mm, Make sure the spacing between boards should be ≥1.6mm, otherwise it will be hard to process routing. |
| Surface Finishes | OSP｜HASL｜HASL Lead-Free (HASL LF)｜Immersion Silver｜Immersion Tin｜Plated Gold｜Immersion Gold(ENIG)｜ENEPIG｜Golden Finger+HASL｜ENIG+OSP｜ENIG+Golden Finger｜OSP+Golden Finger, etc. |
| Solder-Mask Finishing | (1). Wet Film (LPI Soldermask) |
| (2). Peelable Soldermask | |
| Solder Mask Colors | Green｜Red｜White｜Black, Blue｜Yellow｜Orange｜Purple, Gray｜Transparent .etc. |
| Matte: Green｜Blue｜Black, etc. | |
| Silkscreen Colors | Black｜White｜Yellow, etc. |
| Electrical Testing | Fixture / Flying Probe |
| Other Testing | AOI, X-Ray(AU&NI), Two-dimension Measurement, Hole Copper Instrument, Controlled Impedance Test(Coupon test&Third Party Report), Metalloscope, Peeling Strength Tester, Solderability Test, Logic Contamination Test |
| Profile | (1). CNC Routing (±0.1mm) |
| (2). CNC V-Cut(±0.05mm) | |
| (3). Bevelling | |
| (4). Mould-Die Punching(±0.1mm) | |
| Special Capabilities | Thick Copper, Thick Gold(5U”), Gold Finger, Blind and Buried Hole, Countersink Hole, Semi-hole, Peelable Mask, Carbon Ink, Counter sink hole, Plated board edge, Press fit hole, Control depth hole, VIA in PAD, Non-conductive resin plug hole, Plating plug hole, Coil PCB, Super Mini PCB, Peelable Mask, Controlled Impedance PCB, etc. |
Just upload Gerber files, BOM files and design files, and the KINGFORD team will provide a complete quotation within 24h.