Professional PCB manufacturing and assembly
Building 6, Zone 3, Yuekang Road,Bao'an District, Shenzhen, China
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PCB Fabrication Capability

ItemManufacturing Capability
PCB Layers1~64 Layer
Quality GradeIPC Class 2IPC Class 3
Laminate/Base materialFR-4S1141High TgPTFECeramic PCBPolyimideS1000-2IT180AIsola-FR408HRFR406Isola 370 HRRogersTaconicArlonHalogen Free, etc.
Brand of LaminateKingboardITEQShengyiNanyaIsolaTUCSYLArlonNelcoTaconicHitachiRogers, etc.
High Temperature MaterialNormal Tg: Shengyi S1141KB6160Huazhen H140not suitable for lead-free process 
Middle Tg: For HDImultilayers: SY S1000HITEQIT158HuazhengH150TU-662SY S1150GHuazhengH150HFH160HF
High Tg: For thick copperhigh layer: SY S1000-2ITEQIT180AHuazhengH170ISOLA: FR408R370HRTU-752SY S1165
High Frequency Circuit Board MaterialRogersArlonTaconicSY SCGA-500S7136HuazhengH5000
High Speed PCB MaterialSY S7439TU-862HFTU-872SLKISOLA: I-Speed, I-Tera@MT40HuazhengH175H180H380
InkTaiyo INK (Japan)KUANGSHUN(China)RONGDA(China)Coates Screen(UK)S.M Materials(Taiwan, China)
Heat Conductivity for Alu. Boards1.0 
ChemicalRohm&Haas (US)Atotech (Germany)Umicore (Germany)
PCB Type and ServicesPrototype PCBRigid PCBFlexible PCB(FPC)Rigid-Flex PCBHDI PCBHigh Tg PCBBGA PCBImpedance Control PCBIMS PCB(LED PCB Board, Aluminum PCB, Metal Core PCB)Multilayer PCBPCBA(PCB Assembly Service)
Max Board Size609 * 889 mm
Board Thickness0.1~8.0mm
Board Thickness Tolerance±0.1mm / ±10%
Min base copper thicknessOuter layer:1/3oz (12um) ~10ozInner layer:1/2oz~6oz
Max finished copperthickness6 OZ
Min Mechanical Drilling Hole Size6mil(0.15mm)
Min Laser Drilling Hole Size3mil(0.075mm)
Min CNC Drilling Hole Size0.15mm
Hole Wall RoughnessMax1.5mil
Min trace width/spacing(Inner Layer)2/2mil(Outer layer:1/3oz,Inner layer:1/2oz) H/H OZ base copper
Min trace width/spacing(Outer Layer)2.5/2.5mil H/H OZ base copper
Min spacing between hole to inner layer conductor6mil
Min spacing between hole to outer layer conductor6mil
Min annular ring for via3mil
Min annular ring for component hole5mil
Min BGA diameter8mil
Min BGA pitch0.4mm
Min Finished hole size0.15mmCNC)|0.1mmLaser
Half Hole DiameterMinimum Half hole Diameter: 1mm, Half hole is a special technology, so half hole diameter should be greater than 1mm.
Hole Wall Copper Thickness (Thinnest)≥0.71mil
Hole Wall Copper Thickness (Average)≥0.8mil
Minimum Air Gap0.07mm(3mil)
Fine SMD Pitch0.07mm(3mil)
Max aspect ratios20:01
Min soldermask bridge width3mil
Soldermask/circuit processing methodFilmLDI
Min thickness for insulating layer2mil
HDI & special type PCBHDI1-3 steps)|R-FPC2-16 layers)|High frequency mix-pressing2-14 layers)|Buried capacitance & resistance …
Max. PTH (Round Hole)8mm
Max. PTH (Round Slot Holes)6*10mm
PTH Deviation±3mil
PTH Deviation (Width)±4mil
PTH Deviation (Length)±5mil
NPTH Deviation±2mil
NPTH Deviation (Width)±3mil
NPTH Deviation (Length)±4mil
Hole Position Deviation±3mil
Character TypesSerial NumberBarcodeQR Code
Min Character Width (Legend)≥0.15mm, Characters width less than 0.15mm will be unidentifiable.
Min Character Height (Legend)≥0.8mm, Characters height less than 0.8mm will be unidentifiable.
Character Width to Height Ratio (Legend)1:5, 1:5 is the most suitable ratio for production.
Distance between Trace and Outline≥0.3mm(12mil), Ship as individual boards: Distance between Trace and Outline ≥0.3mm, Ship as Panelized boards with V-cut: Distance between Trace and V-cut line ≥0.4mm
Panelization without Spacing0mm, Ship as Panelized boards and the spacing between boards is 0mm.
Panelization with Spacing1.6mm, Make sure the spacing between boards should be ≥1.6mm, otherwise it will be hard to process routing.
Surface FinishesOSPHASLHASL Lead-Free (HASL LF)Immersion SilverImmersion TinPlated GoldImmersion Gold(ENIG)ENEPIGGolden Finger+HASLENIG+OSPENIG+Golden FingerOSP+Golden Finger, etc.
Solder-Mask Finishing(1). Wet Film (LPI Soldermask)
(2). Peelable Soldermask
Solder Mask ColorsGreenRedWhiteBlack, BlueYellowOrangePurple, GrayTransparent .etc.
Matte: GreenBlueBlack, etc.
Silkscreen ColorsBlackWhiteYellow, etc.
Electrical TestingFixture / Flying Probe
Other TestingAOI, X-Ray(AU&NI), Two-dimension Measurement, Hole Copper Instrument, Controlled Impedance Test(Coupon test&Third Party Report), Metalloscope, Peeling Strength Tester, Solderability Test, Logic Contamination Test
Profile(1). CNC Routing (±0.1mm)
(2). CNC V-Cut(±0.05mm)
(3). Bevelling
(4). Mould-Die Punching(±0.1mm)
Special CapabilitiesThick Copper, Thick Gold(5U”), Gold Finger, Blind and Buried Hole, Countersink Hole, Semi-hole, Peelable Mask, Carbon Ink, Counter sink hole, Plated board edge, Press fit hole, Control depth hole, VIA in PAD, Non-conductive resin plug hole, Plating plug hole, Coil PCB, Super Mini PCB, Peelable Mask, Controlled Impedance PCB, etc.

Just upload Gerber files, BOM files and design files, and the KINGFORD team will provide a complete quotation within 24h.