Kingford focus on the high-quality PCBA order demand of "Multiple varieties, medium and small batch, and short lead time".
HDI (High Density Interconnect) PCB process Capability | ||
Item | batch | Template |
layers | 4-16 Layers | 4-24 Layers |
Plate thICkness range | 0.6-3.2mm | 0.4-6.0mm |
highest order | 4+N+4 | Any layer innterconnected |
Minimum laser hole | 4mil (0.1mm) | 3mil (0.075mm) |
Laser process | CO2 Laser Machine | CO2 Laser Machine |
Tg value | 140/150/170°C | 140/150/170°C |
hole copper | 12-18μm | 12-18μm |
Impedance tolerance | +/-10% | +/-7% |
interlayer alignment | +/-3mil | +/-2mil |
Solder Mask Alignment | +/-2mil | +/-1mil |
Minimum line width/line spacing | 2.5/2.5mil | 2.0/2.0mil |
SMAllest grommet | 2.5mil | 2.5mil |
Minimum through hole | 8mil (0.2mm) | 6mil(0.15mm) |
smallest micropore | 4.0mil | 3.0mil |
Minimum media thickness | 3.0mil | 2.0mil |
Minimum pad | 12mil | 10mil |
Micropore Aperture Aspect Ratio | 1:1 | 1:2:1 |
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