Professional PCB manufacturing and assembly
Building 6, Zone 3, Yuekang Road,Bao'an District, Shenzhen, China
+86-13923401642Mon.-Sat.08:00-20:00
| HDI (High Density Interconnect) PCB Process Capability | ||
| Item | batch | Template |
| layers | 4-16 Layers | 4-24 Layers |
| Plate thickness range | 0.6-3.2mm | 0.4-6.0mm |
| highest order | 4+N+4 | Any layer innterconnected |
| Minimum laser hole | 4mil (0.1mm) | 3mil (0.075mm) |
| Laser process | CO2 Laser Machine | CO2 Laser Machine |
| Tg value | 140/150/170°C | 140/150/170°C |
| hole copper | 12-18μm | 12-18μm |
| Impedance tolerance | +/-10% | +/-7% |
| interlayer alignment | +/-3mil | +/-2mil |
| Solder Mask Alignment | +/-2mil | +/-1mil |
| Minimum line width/line spacing | 2.5/2.5mil | 2.0/2.0mil |
| Smallest grommet | 2.5mil | 2.5mil |
| Minimum through hole | 8mil (0.2mm) | 6mil(0.15mm) |
| smallest micropore | 4.0mil | 3.0mil |
| Minimum media thickness | 3.0mil | 2.0mil |
| Minimum pad | 12mil | 10mil |
| Micropore Aperture Aspect Ratio | 1：1 | 1：2：1 |
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Just upload Gerber files, BOM files and design files, and the KINGFORD team will provide a complete quotation within 24h.