Multilayer PCB Capability

Multilayer PCB Production Capability
Item	Capability
Layer Count	1-40layers
Base Material	KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350B、Rogers4000、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)
Board Type	Backplane、HDI、High multi-layer 、blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill.
Board Thickness	0.2-5.0mm
Copper Thickness	Min. 1/2 OZ, Max. 10 OZ
PTH Wall	25um(1mil)
Maximum Board Size	1100500mm(43”19”)
Min laser drilling size	4mil
Min. Spacing/Tracing	2.7mil/2.7mil
Solder Mask	Green, Black, Blue, Red, White, Yellow, Purple matte/glossy
Surface Treatment	Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead-free 、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP, ENIG+Gold finger, Flash gold(electroplated gold)+Gold finger, Immersion silver+Gold finger, Immersion Tin+Gold finger.
Min. Annular Ring	3mil
Aspect ratio	10:1(HASL Lead-free 、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)
Impedance control	±5ohm(＜50ohm), ±10%(≥50ohm)
Other Techniques	Blind/Buried Via
	Gold Fingers
	Press Fit
	Via in Pad
	Electrical Test