Kingford focus on the high-quality PCBA order demand of "Multiple varieties, medium and small batch, and short lead time".
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FPC Fabrication Capability

ItemUsualUnusual
PCB layers1 – 12 layers
Laminate | MaterialFlexible part: DuPont PI, Shengyi PI
Rigid part: PI/FR4
FR4, for lead-free welding
low-loss material
Halogen free
Special materials: Rogers/Arlon/Nelco/TaconIC etc
PTFE
Polyimide
Delivery SizeDelivery Size570X610mm570X610mm
Production size610X640mm610X640mm
board Thicknessthinnest0.25 mm0.20 mm
thickest5.00 mm5.50 mm
Finished board thickness tolerance±2mil(±0.04m)
Copper ThicknessInner Layer1/3-28 OZ1/3-30 OZ
Outer Layer1/7-28 OZ1/7-30 OZ
Inner LineMinimum line width50μm50μm
Minimum line spacing75μm50μm
Outer LineMinimum line width75μm50μm
Minimum line spacing75μm50μm
Min. mechanical Via hole, minimum padinner Layer0.45 mm0.40 mm
Outer Layer0.40 mm0.35 mm
Laser Via hole minimum padinner Layer0.25 mm0.23 mm
Outer Layer0.25 mm0.23 mm
Thickness to diameter ratioLBMV1:011:01
MVTH1:121:16
Min. dielectric thicknessInner core board0.025 mm0.025 mm
Prepreg0.05 mm0.05 mm
Solder resistmin. spacing60 μm40 μm
Min. Solder resist bridge75 μm65 μm
Buried capacitanceInsulation thickness: 14 μm
unit-area capacitance: 6.4 nF/in2
Breakdown voltage: >100V
Buried resistorresistance per unit area(ohms/sq.) : 25, 50, 100, 200
Impedance control accuracy10%5%
Plug holeink plughole
resin plug holes
copper slurry plughole
Min Tracing/Spacing2.5mil/2.5mil
Min. Annular Ring4mil
Min. Drilling Hole Diameter8mil(0.15mm)
Min. mechanical drilling0.15 mm0.15 mm
Laser aperture0.10-0.2 0mm0.10-0.20 mm
Min. finished via diameter6mil(0.15mm)
Tolerance of dimension3mil(0.076 mm)
Solder Mask ColorGreen, White, Blue, Black, Red, Yellow
Silkscreen ColorWhite, Black, Yellow
Surface FinishOSP
HASL(Hot Air Solder Leveling)
HASL Lead-Free
Flash Gold
ENIG (Electroless Nickle/Immersion Gold)
Immersion Tin
Immersion Silver
Special technologiesImpedance Control+/-10%
Gold fingers
Stiffener (PI/FR4)
Peelable solder mask


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