FPC Fabrication Capability

Item		Usual	Unusual
PCB Layers		1 – 12 layers
Laminate \| Material		Flexible part: DuPont PI, Shengyi PI
		Rigid part: PI/FR4
		FR4, for lead-free welding
		low-loss material
		Halogen free
		Special materials: Rogers/Arlon/Nelco/Taconic etc
		PTFE
		Polyimide
Delivery Size	Delivery Size	570X610mm	570X610mm
	Production size	610X640mm	610X640mm
Board Thickness	thinnest	0.25 mm	0.20 mm
	thickest	5.00 mm	5.50 mm
Finished board thickness tolerance	±2mil(±0.04m)
Copper Thickness	Inner Layer	1/3-28 OZ	1/3-30 OZ
	Outer Layer	1/7-28 OZ	1/7-30 OZ
Inner Line	Minimum line width	50μm	50μm
	Minimum line spacing	75μm	50μm
Outer Line	Minimum line width	75μm	50μm
	Minimum line spacing	75μm	50μm
Min. mechanical Via hole, minimum pad	inner Layer	0.45 mm	0.40 mm
	Outer Layer	0.40 mm	0.35 mm
Laser Via hole minimum pad	inner Layer	0.25 mm	0.23 mm
	Outer Layer	0.25 mm	0.23 mm
Thickness to diameter ratio	LBMV	1:01	1:01
	MVTH	1:12	1:16
Min. dielectric thickness	Inner core board	0.025 mm	0.025 mm
	Prepreg	0.05 mm	0.05 mm
Solder resist	min. spacing	60 μm	40 μm
	Min. Solder resist bridge	75 μm	65 μm
Buried capacitance	Insulation thickness: 14 μm
	unit-area capacitance: 6.4 nF/in2
	Breakdown voltage: >100V
Buried resistor	Resistance per unit area(ohms/sq.) : 25, 50, 100, 200
Impedance control accuracy		10%	5%
Plug hole	ink plughole
	resin plug holes
	copper slurry plughole
Min Tracing/Spacing	2.5mil/2.5mil
Min. Annular Ring	4mil
Min. Drilling Hole Diameter	8mil(0.15mm)
Min. mechanical drilling		0.15 mm	0.15 mm
Laser aperture		0.10-0.2 0mm	0.10-0.20 mm
Min. finished via diameter	6mil(0.15mm)
Tolerance of dimension	3mil(0.076 mm)
Solder Mask Color	Green, White, Blue, Black, Red, Yellow
Silkscreen Color	White, Black, Yellow
Surface Finish	OSP
	HASL(Hot Air Solder Leveling)
	HASL Lead-Free
	Flash Gold
	ENIG (Electroless Nickle/Immersion Gold)
	Immersion Tin
	Immersion Silver
Special technologies	Impedance Control+/-10%
	Gold fingers
	Stiffener (PI/FR4)
	Peelable solder mask