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FPC

FPC Fabrication Capability

ItemUsualUnusualPCB Layers1 – 12 layersLaminate | MaterialFlexible part: DuPont PI, Shengyi PIRigid part: PI/FR4FR4, for lead-free weldinglow-loss materialHalogen freeSpecial materials: Rogers/Arlon/Nelco/Taconic etcPTFEPolyimideDelivery SizeDelivery Size

PC shape and hole machining: Double sided FPC manufacturing process

In order to improve the punching accuracy, high precision and low chip punching method is used to process positioning holes

Brief introduction to the main points of SMT assembly process of BGA components FPC factory When SMT (Surface Mount Technology)/SMD (Surface Mount Device) practitioners find that QFP (Quad Flat Package) with a pitch of 0.3mm cannot be realized, the emerge

Brief introduction to the main points of SMT assembly process of BGA componentsFPC factory When SMT (Surface Mount Technology)/SMD (Surface Mount Device) practitioners find that QFP (Quad Flat Package) with a pitch of 0.3mm cannot be realized, the emergen

Causes, treatment methods and application range of degumming in FPC hot press

Impedance circuit board Analysis of PCB circuit board impedance reasonspcb circuit board impedance refers to the resistance and reactance of the parameter, the alternating current plays an obstruction role. Impedance processing is essential in pcb circuit

The FPC connector is used to connect the LCD screen to the driver circuit (PCB)

The PCB should be inserted into the chassis. Do not install the PCB in the open position or inside joints.

Hardware design combat the first FPC design overview

In the actual application, according to the application needs to determine whether ESD shielding is needed, when the FPC flexibility requirements are not high, solid copper, thick medium can be used to achieve.

Flexible circuit board FPC hot air leveling

it is easy to drill solder from the end of the covering layer to under the covering layer, especially when the bonding strength of the covering layer and copper foil surface is low, this phenomenon is more likely to occur frequently.

Flexible circuit board FPC surface plating knowledge

The multilayer soft PCB board made of polyimide film as the base material is about 1/3 lighter than the rigid epoxy glass cloth multilayer PCB board, but it loses the excellent flexibility of single-sided and double-sided soft PCB. Most of these products

FPC material properties

In addition, bismale PI's friction and wear characteristics are also extremely superior, and it can also have a certain degree of wear resistance for applications that are easy to wear.

Where can FPC flexible circuit board processing be done?

The causes of SMT printing leakage and tin deficiency are as follows: 1. Tin paste printing principle, 2. Observation, thinking, comparison, 3. Bare copper plate printing verification

How to eliminate FPC patch processing uneven problem?

Factors leading to uneven processing of FPC patch: 1. FPC deformation; 2. 2. Thickness and position of attached materials; 3. FPC strengthen the thickness of the plate or the back glue

What's the difference between PCB hard board and FPC soft board?

PCB hard board and FPC soft board difference: 1. Rigid PCB: often used as motherboard, cannot bend, 2. Flexible board: FPC also known as flexible circuit board, can be bent

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