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ItemUsualUnusualPCB Layers1 – 12 layersLaminate | MaterialFlexible part: DuPont PI, Shengyi PIRigid part: PI/FR4FR4, for lead-free weldinglow-loss materialHalogen freeSpecial materials: Rogers/Arlon/Nelco/Taconic etcPTFEPolyimideDelivery SizeDelivery Size
In order to improve the punching accuracy, high precision and low chip punching method is used to process positioning holes
Brief introduction to the main points of SMT assembly process of BGA componentsFPC factory When SMT (Surface Mount Technology)/SMD (Surface Mount Device) practitioners find that QFP (Quad Flat Package) with a pitch of 0.3mm cannot be realized, the emergen
Impedance circuit board Analysis of PCB circuit board impedance reasonspcb circuit board impedance refers to the resistance and reactance of the parameter, the alternating current plays an obstruction role. Impedance processing is essential in pcb circuit
The PCB should be inserted into the chassis. Do not install the PCB in the open position or inside joints.
In the actual application, according to the application needs to determine whether ESD shielding is needed, when the FPC flexibility requirements are not high, solid copper, thick medium can be used to achieve.
it is easy to drill solder from the end of the covering layer to under the covering layer, especially when the bonding strength of the covering layer and copper foil surface is low, this phenomenon is more likely to occur frequently.
The multilayer soft PCB board made of polyimide film as the base material is about 1/3 lighter than the rigid epoxy glass cloth multilayer PCB board, but it loses the excellent flexibility of single-sided and double-sided soft PCB. Most of these products
In addition, bismale PI's friction and wear characteristics are also extremely superior, and it can also have a certain degree of wear resistance for applications that are easy to wear.
The causes of SMT printing leakage and tin deficiency are as follows: 1. Tin paste printing principle, 2. Observation, thinking, comparison, 3. Bare copper plate printing verification
Factors leading to uneven processing of FPC patch: 1. FPC deformation; 2. 2. Thickness and position of attached materials; 3. FPC strengthen the thickness of the plate or the back glue
PCB hard board and FPC soft board difference: 1. Rigid PCB: often used as motherboard, cannot bend, 2. Flexible board: FPC also known as flexible circuit board, can be bent