Specification for size of patch element sealing pad in PCB
There is no through hole between the welding pads of components without external pins (such as chip resistance, capacitor, adjustable potentiometer, adjustable capacitor,
There is no through hole between the welding pads of components without external pins (such as chip resistance, capacitor, adjustable potentiometer, adjustable capacitor,
All of these problems can cause the solder shield to detach from the circuit board and eventually lead to corrosion of the copper circuit. Poor insulation characteristics can cause short circuits due to unexpected electrical connectivity/arcing.
All of these problems can cause the solder shield to detach from the circuit board and eventually lead to corrosion of the copper circuit. Poor insulation due to thin solder resistance layer can cause short circuit due to unexpected conduction/arc.
Based on the changes in the international trade environment, PCB industry is still under a big test, originally in the capital chain break and environmental pressure impact of small and medium-sized PCB manufacturers, are also accelerating out of the shuf
PCB has become the most important and key part of electronic information products. Its quality and reliability level determine the quality and reliability of the whole equipment.
It has many advanced features, capable of simulating laminar and turbulent flow as well as multi-type analysis, including radiation and convection. Icepak offers a huge library of fans, radiators and materials that provide solutions to everyday electronic
The PCB industry will benefit a lot in the industrial chain. With the emergence and rapid progress of 5G communication technology, a number of related fields are entering the situation of technology iteration and product application upgrade simultaneously
What is the core power supply, is some power supply current, the number of the kind. A plane, not more than 3 power supply division. It is important to consider that segmentation cannot present current-carrying bottlenecks.
he natural bubble is caused by the reaction of hydrogen in the chemical copper solution, or the cathode to produce hydrogen or anode to produce oxygen in the electroplating solution.
The removal of copper from the through-hole can be caused by chemical factors, such as etching, or mechanical causes, such as blow-holing, stress cracking, or deposition detachment.
PCB products in quality and quantity, continue to tilt to the high-tech field, enterprises in technology research and development investment will continue to increase.
According to Prismark statistics, mobile terminal PCB demand is mainly HDI and flexible board (HDI board accounts for about 50.68%), and has 26.36% packaging substrate demand.