In order to better choose PCBA processing plant, it is necessary to pay attention to equipment and facilities to have professional PCBA equipment, assembly tracking system, material inspection and scrap facilities; Technical personnel should have emergenc
PCBA three anti paint coating methods: 1, impregnation, 2, spraying, 3, brush coating, 4, selective coating
There are two basic principles to determine the distance between the multilayer capacitor power layer and the edge of the board in the capacitor design of multilayer PCB board, and to solve the distance between the printing strip: 20-H method and 3-W meth
In the process of high-speed circuit design, we must consider how to deal with the radiation of the power supply and the interference to the whole system. Generally, the area of the power layer plane should be smaller than the area of the ground plane, so
The use of direct paving mode is characterized by a strong overcurrent capacity of the pad, for high-power circuit device pins must be used in this way. At the same time, its thermal conductivity is also very strong, although the work is good for the heat
Check the buffering action of the suction nozzle fixture of the parts of the patch machine on time. If the buffering action is not smooth, it is recommended to apply a thin layer of lubricant. If the fixture is loose, tighten the moving lens to clean the
What are the characteristics of PCBA assembly plants? First, design ability of PCBA assembly plant; second, quality control of PCBA assembly plant; third, technical support of PCBA assembly plant
PCB fabrication is one of the most important steps for PCBA processing plant to complete the task quickly and accurately, including: the process design of the board, tooling design and production, the production of the circuit board
Place some grounded holes near the holes of the signal changing layer in order to provide the nearest loop for the signal.
Compared with the circuit material without microsphere packing, the RO4730G3 circuit material with hollow microsphere packing may form metallized pores on the surface of rough pore wall.
The test circuits are based on a microstrip transmission line structure with a through-hole in the middle of the circuit used as a conductor and signal transition from the top copper layer of the dielectric substrate material to the bottom copper layer.
Nickel-gold plating is the ancestor of the PCB surface treatment process. It has been around since the appearance of PCBS and has slowly evolved into other methods. It is the PCB surface conductor is first coated with a layer of nickel and then coated wit
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