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How do PCBA processors handle humidity sensors correctly?
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How do PCBA processors handle humidity sensors correctly?

PCBA processing manufacturers in the patch processing sometimes encounter some more special components, such as MSD, that is, humidity sensitive components, referred to as humidity sensitive components, which is susceptible to environmental temperature and humidity and electrostatic effects of a class of electronic components. The impact of humidity-sensitive components on SMT chip processing is not even lower than ESD, and it is necessary to strengthen the storage and use management of humidity-sensitive components in SMT processing.

PCBA processing manufacturers can standardize the process control method of MSD, so as to avoid component damage caused by humidity sensor moisture absorption in the reflow welding process to reduce the resulting product defect rate, and improve product reliability.

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In the actual processing of damp MSD, is generally baked in accordance with the manufacturer's original packaging bag warning label baking conditions. For components manufacturers do not have corresponding requirements, it is recommended to use high temperature baking method. During the replacement of the MSD carrier, pay attention to preventing ESD damage to the components. Low temperature baking conditions are not recommended for general MSD baking.

PCBA processing moisture sensitive devices use precautions

1.Ovens for baking are required to be ventilated and able to maintain the required temperature at a humidity of less than 5%.

2. SMT patch components transported in high-temperature carriers can be baked at 125 ° C if not specifically stated by the manufacturer. 

3. SMT patch components transported in low-temperature carriers can not be baked at temperatures higher than 40 ° C. If higher temperature baking is used, the low temperature carrier should be removed and replaced with a high temperature resistant carrier.

4. The paper or plastic carrier should be evacuated before baking, and the rubber belt or plastic tray should also be evacuated when baking at 125℃.

Kinhford Electronics Co., Ltd. specializes in providing integrated PCBA electronic manufacturing services, including upstream electronic component procurement to PCB production and processing, SMT patches, DIP plug-ins, PCBA testing, finished product assembly and other one-stop services.

The company gives full play to its competitive advantages in scale procurement and quality control, and has signed long-term cooperation agreements with many electronic component manufacturers at home and abroad and around the world to ensure the quality and stable supply of raw materials, and transfer the benefits to customers.

Just upload Gerber files, BOM files and design files, and the KINGFORD team will provide a complete quotation within 24h.