When the circuit board is pressed together with the release film, the silicone oil will be transferred to the circuit board, resulting in poor binding degree, so the silicone oil on the surface of the product needs to be completely cleaned before a step p
All kinds of reliability design in digital circuit application is related to the reliability requirements of the circuit in practical application and product engineering requirements, so it is not possible to add various kinds of high-cost "guarantee...
The design specification of soft - hard combined board and flexible circuit board is discussed in detail
Electrolysis of copper foil is also used in situations where the carrying capacity of the current can be increased by increasing the weight of copper to achieve a copper width, such as planar inductors.
The insulating substrate may be polyimide, polyethylene terephthalate, arylamide fiber ester and polyvinyl chloride.
it is easy to drill solder from the end of the covering layer to under the covering layer, especially when the bonding strength of the covering layer and copper foil surface is low, this phenomenon is more likely to occur frequently.
The multilayer soft PCB board made of polyimide film as the base material is about 1/3 lighter than the rigid epoxy glass cloth multilayer PCB board, but it loses the excellent flexibility of single-sided and double-sided soft PCB. Most of these products
The causes of SMT printing leakage and tin deficiency are as follows: 1. Tin paste printing principle, 2. Observation, thinking, comparison, 3. Bare copper plate printing verification
The characteristics of flexible circuit board patch: 1, flexible circuit board patch after all lines configuration, less than other circuit board assembly, 2, flexible circuit board itself small size is more convenient to carry, 3, light weight, flexible
Flexible PCBS (FPCS) are increasingly needed, and PCB manufacturers are accelerating the development of thinner, lighter and more dense FPCS.
With the continuous advancement of information and intelligent construction, the market demand for flexible circuit boards will be more and more large.
The market share of FPC is increasing with the development of miniaturized and portable electronic products. However, FPC may have defects such as open circuit, short circuit and line width discrepancy in the process of processing, feeding and mounting.
The challenge for the flexible circuit industry is to take advantage of its technological advantages and stay abreast of computers, telecommunications, consumer demand, and dynamic markets.