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Reasons and countermeasures of solder spatter in PCBA wave soldering
13Jun
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Reasons and countermeasures of solder spatter in PCBA wave soldering

Reasons and countermeasures of solder spatter in PCBA wave soldering

PCBA wave soldering is a common electronic manufacturing process. In the process, the spatter of solder paste due to high temperature is an insoluble problem. There are many reasons for solder paste spatter, which may be related to the quality of the solder paste, the interconnect structure, the operation of the equipment, and the environment. kinhford Electronics will analyze the causes of solder spatter in PCBA wave soldering in detail and propose corresponding countermeasures.

There are many reasons affecting the quality of PCBA wave soldering, and the quality of solder paste is one of them. The selection and use of solder paste have strict requirements. First of all, the viscosity of the solder paste needs to be moderate, too high will cause the solder paste difficult to press, too low will cause the solder paste can not form the correct coating on the component and PCB surface. Secondly, the amount of flux and active agent in the solder paste also needs to be appropriate. If the amount of these substances is too much, the solder paste will produce bubbles and smoke at high temperatures, thereby increasing the probability of the solder paste splashing. Finally, the service life of the solder paste can not be ignored. Long service life of solder paste may lead to a decline in quality and increase the probability of solder paste spatter.31 (1)https://www.kingfordpcb.com/yuan.php

The interconnect structure is also an important factor in PCBA wave soldering. Incompatibility with thermal runaway or component reflux processes should be avoided when designing interconnect structures. The welding pad structure shall determine the location of the welding, and on the premise of providing good stability for the component, so that the welding pad itself has as little thermal effect on the component as possible. If the welding pad itself has a large thermal effect on the component, it is easy to lead to a gap between the welding pad and the component, resulting in a solder paste splash.

In addition to the solder paste and interconnect structure, the operator and the environment can also affect the quality of PCBA wave soldering. Factors such as the operator's operation sequence, equipment adjustment and reliability, atmosphere control and purity and temperature will affect the quality of PCBA wave soldering. Especially in the high temperature environment, if the operation is improper, it will not only lead to the splash of the solder paste, but also cause harm to the operator. Therefore, operators need to understand the relevant knowledge of PCBA wave soldering and operate in strict accordance with the operating procedures to ensure the safety of the working environment and the stability of production quality.

So, how should the solder paste splash? Solder paste spatter can cause component damage, even cause failure, improper use may cause harm to the operator. Therefore, to prevent solder paste spatter, we recommend the following measures:

1. Replace the appropriate solder paste to ensure that its quality meets the relevant requirements. 2. Strengthen the design of the interconnect structure, make it reasonable, reduce the gap between the welding pad and the component, in order to reduce the probability of splashing of the welding paste. 3. Carefully control and manage the equipment and atmosphere in the welding process to maintain a correct operating environment. 4. Train and supervise operators to ensure that they operate according to the procedures and master the knowledge of PCBA wave soldering.

In short, the quality of PCBA wave soldering has been affecting the development of the electronics manufacturing industry. In order to avoid the impact of solder paste spatter and other quality problems, we need to conduct strict management and supervision of solder paste quality, interconnect structure, equipment operation and environment. Only when the problems caused by these factors are properly solved can we ensure the high quality production of PCBA wave soldering.

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