SMT patch production process
SMT basic process elements include: screen printing, mounting (curing), reflow soldering, cleaning, testing, repair
Professional PCB manufacturing and assembly
Building 6, Zone 3, Yuekang Road,Bao'an District, Shenzhen, China
+86-13923401642Mon.-Sat.08:00-20:00
AOI application strategy for SMT patch production
Application scope: SMT, LED, BGA, CSP flip chip testing, semiconductor, packaging components, lithium industry, electronic components, automotive parts, photovoltaic industry, aluminum die casting, molded plastics, ceramic products and other special indus
What causes the holes in SMT patch processing
The emptiness is mainly caused by the following reasons: first, welding paste. Two, PCB welding pad surface treatment. Three, reflux curve setting. Four, reflux environment. Five, pad planning. Six, micropores.
What are SMT patch, PCB circuit board, PCBA processing and DIP plug-in respectively
What are SMT patch, PCB circuit board, PCBA processing and DIP plug-in respectively? First, SMT is one of the basic components of electronic components, which is called surface assembly technology; second, PCB is the most important component of electronic
The key process of reflow welding machine in SMT patch processing
Key parameters of reflow welding equipment :1. Number, length and width of temperature zone; 2. Symmetry of upper and lower heaters; 3. Uniformity of temperature distribution in the warm zone; 4. Independence of transmission speed control in temperature i
SMT patch processing technology: Causes of component displacement in patch processing
The reasons for component displacement in patch processing are as follows: 1, the use time of solder paste is limited, 2, the solder paste itself is not sticky enough, 3, the flux content in solder paste is too high, 4, in the process of printing and patc
SMT patch component stele causes and solutions
Factors affecting the printing thickness of solder paste: reduce the thickness of steel mesh plate, is to reduce the amount of solder paste, solder paste melting surface tension will be reduced. When the thickness is reduced, the solder paste is thinner,
SMT patch processing quality precautions and solutions
In the SMT process, there are six mounting quality problems that need attention: 1, mount design quality, 2, mount raw materials (components, PCB, welding paste and other mount materials) quality, 3, mount process quality (process quality), 4, mount weldi
The key technology of reflow welding machine in SMT patch processing
SMT basic process elements: solder paste printing -> Parts mounting --> Reflow welding --> AOI Optical Detection --> Maintenance --> The board is divided.
SMT patch processing repair some skills to share
There are two ways to judge the quality of the circuit board: 1. standard rules of size and thickness, 2. light color, 3. Welding appearance
How to reduce the casting rate in SMT patch proofing
The latest quotation of PCBA is determined by the following three parts: 1. PCB plate: 2. SMT Patch Processing Plate: 3.
SMT patch processing basic introduction
SMT patch processing basic introduction: high assembly density, small size of electronic products, light weight, high reliability, strong vibration resistance. Low defect rate of solder joint, good high-frequency characteristics, reduce electromagnetic an
Telegram
Just upload Gerber files, BOM files and design files, and the KINGFORD team will provide a complete quotation within 24h.