Effective techniques to improve PCB design spread rate and design efficiency: first, PCB board size and wiring layer number need to be determined in the early design, second, automatic wiring tool itself does not know what should be done, third, in the la
Common pads are: 1, square pad, 2, round pad, 3, island pad, 4, polygonal pad, 5, oval pad, 6, open shape pad
PCBA proofing operation process :1. Customers place orders; 2. Customers provide production materials; 3. Purchased raw materials, 4. Incoming material inspection, 5. PCBA production, 6. PCBA testing, 7. After packaging
PCBA in the manufacturing need to consider the issues :1, automatic production line veneer transmission and positioning elements design,2, PCBA assembly process design,3, component layout design,4, assembly process design
PCBA processing wave welding notes :PCBA after wave welding, cleaning board, storage and maintenance may be white around the pad. The white stuff is mostly residue
SMT factory layout and location requirements: 1, fire extinguisher placement area, 2, material rack car placement area, 3, material preparation table placement area, 4, printing station table placement area, 5, tin paste placement area, 6, after the furna
PCBA contracted work and materials matters needing attention :1. Circuit design; 2. Selection of materials; 3. Selection of PCBA factory
The PCB board where the component is placed is placed into the machine from one end. On a double-track conveyor belt, the circuit board of the newly placed component passes through the hot and cold zones of the reflow furnace, precisely controlling the me
In the process of purchasing PCBA, we need to pay urgent attention to PCBA quality control points, and adopt a professional perspective to examine whether each PCBA board meets the application requirements of electronic products.
PCB board making fee, material fee, SMT welding fee, steel mesh fee, PCBA fixture, PCBA test frame and packaging and transportation fee.
The main measures to reduce the surface tension and viscosity in PCBA welding process are as follows: (1) increase the temperature, (2) adjust the proportion of metal alloy, (3) increase the active agent, and (4) improve the PCBA welding process environme
In case of tinning, corresponding measures should be taken: 1. Adjust welding process parameters: 2. Replacement of solder alloy: 3. Replacement of components: 4. Check the surface treatment of PCB board and components: 5. Inspection equipment
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