PCBA processing of aluminum substrate manual soldering wire points for attention: first, pay attention to the welding temperature, two, select the appropriate raw materials, three, with the iron head is harmful to spot welding force
PCBA processing needs to do three requirements: first, the solder paste, must be stored in 5-10 degrees of environment. In order not to affect the use of solder paste, shall not be placed in the environment below zero, second, in the process of SMT proces
In PCBA manufacturing, automatic optical detection is set at the last step of the SMT production line. After the SMT patch processing is completed, product defect detection is required. Through timely detection and reduction of defects, improve assembly e
Quick solution to PCBA short-circuit problem: 1. Use short-circuit positioning analyzer for inspection, 2. Light up the short-circuit network on the PCB diagram. 3. In case of the same short-circuit in batches, take a board to operate the secant line and
PCB design layer number to consider the following problems: 1, use,2, required signal type,3, through hole type,4, required signal layer density and number,5, required plane number,6, manufacturing cost,7, delivery time,
Many factors affect the quality of PCBA quality, including human, machine, material factors, technological factors, environmental factors, etc. The quality of pcba process is mainly affected by the following conditions.
PCB manufacturing process involves circuit board manufacturing, component procurement and inspection, patch processing, plug-in processing, program firing, testing, aging and a series of processes.
Circuit board PCBA processing process can be roughly divided into: empty plate loading - printed solder paste - mounting devices - reflow welding -AOI testing - receiving plate - finished product inspection - parts after welding - circuit board open/short
Common bad reasons for PCBA welding resistance film processing :1. Welding pad and through hole connection. 2. Solder resistance design between pad and pad, solder resistance graphic specifications should conform to the design of welding end distribution
Common heat dissipation mode of circuit board: 1, high heating device plus radiator, heat conduction plate, 2, through the circuit board itself heat dissipation, 3, the use of reasonable design to achieve heat dissipation function, 4, for the use of free
In PCB processing and production, static electricity is not the hazard, the real danger lies in the accumulation of static electricity, and the resulting electrostatic discharge.
In the process of production, packaging and transportation, and the processing, debugging and testing of the integrated machine, it is inevitable to suffer from external or own friction and form a high surface potential.
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