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Standard PCB Production CapabilityFeatureCapabilityQuality GradeStandard IPC 2Number of Layers1 - 32layersOrder Quantity1pc - 10,000,000 pcsBuild Time2days - 5weeks (Expedited Service)MaterialFR-4 Standard Tg 150°C, FR4-High Tg 170°C, FR4-High-Tg 180°C, F
PCB manufacturing principle processThe manufacturing process of PCB is relatively complicated, and there are many process requirements. In fact, there are many specific manufacturing processes on the Internet. Let’s talk about the principle of PCB. PCBs a
PCB manufacturing processSMD (Surface Mounted Devices) is a surface mount device, which is one of the SMT (Surface Mount Technology) components, including CHIP, SOP, SOJ, PLCC, LCCC, QFP, BGA, CSP, FC, MCM, etc. The pins currently used by SMDs can be sold
The output value of the global electroplating PCB industry accounts for the proportion of the total output value of the electronic components industry growing rapidly.
The center of gravity of the entire board should be close to the geometric center of the PCB. The center of gravity should not be allowed to drift to the edge of the board (1/4 area).
sinking gold plate and gold plate is the same process product, electric gold plate and flash gold plate is the same process product, in fact, it is just different people in the PCB industry of different names, sinking gold plate and electric gold plate is
The finger contains a number of exposed copper pads that are actually part of the PCB wiring. Usually to connect, we insert the gold finger on one PCB into the appropriate Slot on the other PCB (generally called an expansion Slot).
TPM and other high-end knowledge, but ignore the field management, ignore the most basic production activities of the people and equipment.
In short, PCB manufacturing is a complex, long project, need to comply with a lot of rules and regulations, to ensure the normal operation of machinery and equipment, to ensure that improve the work efficiency and yield.
Composition of PCB manufacturing production cost: The production cost of PCB products refers to the total of direct materials, direct labor, direct labor and other direct or indirect costs actually consumed in the production process
Image of local separation caused by local expansion between layers of substrate or between substrate and conductive foil or between substrate and protective coating.
Exposed to heat, humidity and pollution, it can still provide excellent electrical properties and maintain satisfactory weldability, but it will miss shine.