As the function requirement of electronic products is higher and higher, the volume requirement is smaller and smaller. In order to meet this need, the welding ball array packaging technology appears.
A total of four BGA were dyed. After the BGA was pulled apart, it could be seen that most of the solder joints were pulled apart from the joint of PCB pad and substrate, and some were pulled apart from the side of pad, but there were holes.
Understand PCB design, PCB layout and PCB manufacturing in PCB related industries and Let's take a look at BGA welding process in PCB industry
The PCB manufacturer, PCB designer and PCBA manufacturer will explain to you which soldering paste should be used for BGA welding, and which is better, white or yellow
PCB manufacturers and PCB designers explain that increasing solder paste can improve BGA welding defects