What is BGA welding
As the function requirement of electronic products is higher and higher, the volume requirement is smaller and smaller. In order to meet this need, the welding ball array packaging technology appears.
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BGA welding joint mixed process type fracture
A total of four BGA were dyed. After the BGA was pulled apart, it could be seen that most of the solder joints were pulled apart from the joint of PCB pad and substrate, and some were pulled apart from the side of pad, but there were holes.
Let's take a look at BGA welding process in PCB industry
Understand PCB design, PCB layout and PCB manufacturing in PCB related industries and Let's take a look at BGA welding process in PCB industry
Which flux paste should be used for BGA welding, and the white and yellow ones are better
The PCB manufacturer, PCB designer and PCBA manufacturer will explain to you which soldering paste should be used for BGA welding, and which is better, white or yellow
Increase the amount of solder paste to improve BGA welding defects?
PCB manufacturers and PCB designers explain that increasing solder paste can improve BGA welding defects
What are the defects of BGA welding
What are the common BGA welding defects? How to handle
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