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SMT environmental requirements and productivity
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SMT environmental requirements and productivity

SMT environmental requirements and productivity
SMT production equipment is a high-precision electromechanICal equipment Equipment and process data have certain requirements on environmental cleanliness, humidity and temperature In order to ensure the normal operation and assembly quality of the equipment, during the SMT patch process, the working environment has the following requirements:
-1: Power supply: The power supply voltage and power must meet the equipment requirements
-The voltage must be stable. Requirements:
Single phase AC220 (220 ± 10%, 50/60 HZ)
If 3-phase AC380V (220 ± 10%, 50/60 HZ) does not meet the requirements, a regulated power supply must be included, and the power of the power supply must be more than twice the power consumption.
-2: Temperature: ambient temperature: 23 ± 3 ℃ is the best. Generally, it is 17-28 ℃, and the limit temperature is 15 35 ℃ (the ambient temperature of the printing workshop should preferably be 23 ± 3 ℃)


-3: Humidity: relative humidity: 45 70% RH
Working environment: Keep the workplace clean and free of dust and corrosive gas.
The air cleanliness is 100000 (BGJ73-84);
In an air-conditioned environment, there must be a certain amount of fresh air, and try to control the CO2 content below 1000PPM and the CO content below 10PPM to ensure human health.
-5: Anti static: the production equipment must be well grounded, and the 3-phase five wire grounding pipeline should be used, and the grounding should be independent. The floor, bench mats and chairs on the production site shall meet the anti-static requirements.
Exhaust: Both reflow and wave soldering equipment have exhaust requirements.
-7: Lighting: The workshop should have good lighting conditions, and the ideal illumination should be 800LUX * 1200LUX, at least not less than 300LUX.
-8: Requirements for SMT production line personnel: the operators of each piece of equipment in the production line must receive professional training and qualification certification, and must be proficient in the operating procedures of the equipment.
Operators shall strictly abide by the Safety Technical Operating Procedures and process requirements.
Methods to Improve Production Efficiency SMT patch processing
SMT wafer processing efficiency has many aspects. For example, if the overall production capacity remains unchanged and the number of smt wafer production lines is large, the production speed can also be improved. However, operating costs are also increasing. Nowadays, the fierce competition in the electronic industry is unimaginable. For the existing patch production line, we must improve the patch rate and win customer satisfaction. The factors of resettlement rate and improvement measures are briefly introduced as follows:
The SMT production line is mainly composed of screen printing machine, high-speed SMT machine, multi-functional SMT machine, reflow welder and AOI automatic detector. If two placement machines complete a placement process (hereinafter referred to as placement time) when they are equal, the placement rate will be affected. The specific methods are as follows:
1. Balance load distribution. Reasonably allocate the number of two placement components to achieve balanced load distribution, so that the placement time of two placement machines is equal;
2. The mounter itself. We all know that the placement machine itself has a maximum placement speed value, but it is usually not easy to reach this value. This has a certain relationship with the structure of the mounter itself. For example, the measure taken by the X/Y structure mounter is to make the mounter head pick up elements as much as possible. On the other hand, when arranging the placement program, the same type of components are arranged together to reduce the number of nozzle changes when the placement head picks up the components and saves the placement. Installation time.
This SMT patch production line consists of many devices If any equipment is being processed and the speed is slow, it will delay the placement time and affect the actual processing How to improve is not only guided by theory, but also rich in field operators Experience

The above is the explanation given by the editor of PCB circuit board company.
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