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How to ensure safety in chip processing
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How to ensure safety in chip processing

How to ensure safety in chip processing

There will be many problems that we attach great importance to in the production process of SMT, especially the security problems encountered in the production process of SMT. Therefore, as long as the SMT processing and production line has done a good job in ensuring the health of employees, it can ensure that the SMT processing and production will not be affected. In this respect, if the electronics factory pays more attention to these details, it can show the manufacturer's humanistic concern, so this is also a way to retain employees. During SMT processing and production, many power supply problems will be encountered, so it is necessary to pay attention to the safety protection operation during SMT chip processing and production. If the power cord is exposed to the outside, it may leak electricity, and then it may cause electric shock, affecting the physical safety of employees. If we touch the power cord, it may cause severe damage to the employees' bodies.

The damage to human body caused by power supply is very serious. Usually, it may cause employees to lose their intuition, or it may lead to disability or death, with severe consequences. Therefore, we should regularly check whether the power supply on the SMT chip processing production line has done a good job in various safety protections, and if there is any doubt, we should correct it in time. In addition, special training on power protection should be provided. If you encounter power risk during operation, you should immediately report the situation to the relevant personnel so that you can deal with the problem immediately and organize the deterioration of the situation at the source. Therefore, if the power supply risk is encountered, we should not be self righteous and start to repair the power supply to avoid the occurrence of risk conditions.

In the SMT chip processing and production process, when using the machine chip in the chip processing program, it should be noted that this machine is a high-speed operation machine. Because of high-speed operation, there is a need for many power sources to ensure the operation of all production lines. Therefore, there are many sharp edges in these power sources, which are all dangerous goods. Therefore, it is necessary to ensure that various protective measures are taken for these machines. In addition, in these places where employees are threatened, attention should be paid to the protection of protective fences. If someone accidentally touches the damaged one, all SMT and operation switches shall be closed immediately. In order to avoid this situation, special gloves should be worn when cleaning the wheels to avoid being cut.

During SMT chip processing and production, we should pay attention to fire safety. Since some fireworks may occur during welding, we should pay special attention to this question. Flammables must not be placed around the production line. If they are ignited, the SMT processing production line operation must be stopped immediately. In the SMT processing and production, attention should be paid to anti-static. The electrostatic protection on the SMT processing and production line must suppress the accumulation of charges, and some measures should be taken to act on the charges that have occurred. Therefore, attention should be paid to anti-static maintenance whether during SMT processing and production or before production.

How to replace chip components in SMT processing

PCB company has its own SMT chip factory, which can provide SMT chip processing services for minimum package 0201 components. Next, we will introduce how to replace chip components after SMT processing and repair. Method of SMT processing and repair Replacing chip components During SMT processing and repair, chip components are one of the materials that are in contact with many people. In SMT processing, it is often necessary to replace chip components. It seems easy to replace the chip components, but there are still many tips. If you don't pay attention, it is still troublesome to operate. To ensure the product quality, we need to replace the chip components in strict accordance with the relevant requirements. Before replacing chip components during SMT processing and repair, we need to prepare an electric soldering iron with ground wire and temperature control. The width of the soldering iron head shall be consistent with the size of the metal end face of the chip mounted element, and the soldering iron shall be heated to 320 ℃.

PCB board

In addition to electric soldering iron, it is also necessary to prepare basic tools such as tweezers, tin bars, fine low-temperature rosin, welding wires, etc. When replacing the chip components, you can directly place the heated soldering iron head on the upper surface of the damaged components, and then use tweezers to directly remove the damaged components after the soldering tin on both sides of the chip components and the adhesive under the components are melted at high temperature. After removing the damaged components, it is necessary to use a tin strip to soak up the tin left on the circuit board, and then use alcohol to clean the adhesive and other stains on the original bonding pad. When PCBA is processed, it is usually necessary to heat a proper amount of solder on one side of the PCB; Then use tweezers to place the element on the bonding pad. In order to quickly heat the tin on the bonding pad, it is necessary to place the molten tin contact sheet element on the metal end. However, it is also important to pay special attention that the soldering iron head must not directly contact the element.

Generally, after one end of the newly replaced chip element is fixed, the other end can be soldered. It is necessary to heat the pad on the circuit board and add an appropriate amount of solder to form a bright arc between the pad and the end face of the component. It should be noted that the amount of soldering tin should not be too much, otherwise the melted soldering tin will flow under the element and cause a short circuit of the bonding pad. Like the other end of the welding, the remaining end can only allow the molten tin to dip into the metal end of the element, and the soldering iron head cannot touch the element, thus completing the entire replacement process.

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