Why is it difficult to tin QFN side in SMT patch processing?
Analysis of the causes of holes (bubbles) in solder joints in PCBA patch processing: 1, the influenc...
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The type and design standard analysis of solder pad in PCB design
The spacing and size of conductive rubber keys shall be consistent with the actual size of conductiv...
Talk about ground suppression and interference in PCB design
The larger the number of turns of common mode choke, the larger the parasitic capacitance and the wo...
In 2020, the output value of the global printed circuit board will reach $66.1 billion
Local collision occurs in PCB process, and the copper wire is separated from the substrate by extern...
PCB copper coating should pay attention to those problems? How to choose solid copper and grid copper?
the copper coating on PCB, if the grounding problem is handled well, is certainly "more advanta...
Calculation of characteristic impedance
Poor weldability of circuit board holes will produce virtual welding defects, affect the parameters ...
In multilayer circuit boards
the production of controllable impedance boards is becoming more and more important.
In the design of six types of modular PCB in China
In PCB board copy and design work, we often have to debug and test the circuit board, the debugging ...
PCB board debugging technology of six types of modules
The trial-production process of six types of modules generally carried out by domestic counterparts ...
Damage analysis and summary of laser coding on PCB materials
The copper roots narrow the line spacing, resulting in the printed board does not meet the requireme...
Destructive analysis of laser coding on PCB materials
Laser marking can be a variety of characters, symbols and patterns, character size can be from milli...
Maintenance of pcb etching equipment
The formation of residual film slagging indicates that the previous film removal process is not thor...
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