PCB design and manufacturing guide
Surface mount technology is very convenient in the manufacture of many PCBS. Reliable and fast profe...
Surface mount technology is very convenient in the manufacture of many PCBS. Reliable and fast profe...
SMT patch processing main characteristics: 1, high density: 2, small aperture: 3, low coefficient of...
Common treatment methods are added sewing capacitor and bridge :1, sewing capacitor, 2, bridge, 3, m...
Manual welding methods for SMT patch processing of leadless chip components: one by one welding spot...
There are the following factors affecting PCB welding quality: PCB diagram, circuit board quality, d...
PCB design service process: 1. The customer provides schematic diagram to consult PCB design; 2. 2. ...
The reasons for the need for post-welding processing are as follows: 1, the components are not resis...
SMT SMT technology: The main content of surface assembly technology can be divided into four parts: ...
SMT basic process elements include: screen printing, mounting (curing), reflow soldering, cleaning, ...
Factors affecting the quality of BGA patch assembly: 1. Feasibility of BGA pad design, 2. The throug...
Aluminum substrate and glass fiber plate difference and applicationFirst, glass fiber board (FR4, si...
Application scope: SMT, LED, BGA, CSP flip chip testing, semiconductor, packaging components, lithiu...