Through Hole PCB Assembly

Name: Through Hole PCB Assembly Telecom Equipment PCB

Substrate: FR4

Copper Thickness: 1/3OZ- 6OZ

Plate thickness: 0.21-6.0mm

minute. Hole size: 0.20mm

minute. Line width: 4 million

minute. Line spacing: 0.075 mm

Surface treatment: spray tin/gold drill/OSP/lead-free spray tin

Board size: minimum 10*15mm, maximum 508*889mm

Product Type: OEM&ODM

PCB standard: IPC-A-610 D/IPC-III standard

Certificate: ISO9001/ CE//TUV/ ROHS

Warranty: 1 year

Service: One-stop turnkey service

Electronic testing: 100%

Logistics: Air/Sea