When PCBA is processed in the furnace: Because the pin of the plug-in element is scour by tin flow, some plug-in elements will be tilted after welding in the furnace, resulting in the element body beyond the screen frame, so it is required to repair weldi
The main reasons for solder joint failure in PCBA processing are as follows: 1, component pin is bad: 2, PCB solder pad is bad: 3, solder quality defects: 4, solder quality defects: 5, process parameter control defects: 6, other auxiliary materials defect
Methods for rapid maintenance of faults after PCBA processing: one, visual inspection method, two, resistance method, three, voltage method, four, waveform method, five, current method, six, component replacement method, seven, step by step investigation
When the solder paste reaches the melting temperature, under the action of balanced surface tension, there will be a self-positioning effect, that is, when there is a small deviation from the component placement position, under the action of surface tensi
PCBA processing using expired PCB board three hazards: 1, PCBA processing using expired PCB may cause oxidation of PCB surface welding pad, 2, PCBA processing using expired PCB may cause moisture absorption and burst board, 3, PCBA processing using expire
SMT surface mount technology has the following 5 steps: 1. PCB production - this is the actual production stage of PCB with solder points; 2. Deposit solder on the pad to fix the assembly to the plate; 3. With the help of the machine, the components are p
The reasons for the formation of tin beads in PCBA processing: 1. When the PCB board leaves the liquid solder, it is very easy to form tin beads, 2. The second reason for the formation of tin beads is the release of volatile substances in PCB board and so
PCB board temperature resistance test method: In order to ensure the quality of PCB board, it is necessary to carry out temperature resistance test, usually the highest temperature resistance of PCB board is 300 degrees, 5-10 seconds; Over lead-free wave
PCBA processing of aluminum substrate manual soldering wire points for attention: first, pay attention to the welding temperature, two, select the appropriate raw materials, three, with the iron head is harmful to spot welding force
PCBA processing needs to do three requirements: first, the solder paste, must be stored in 5-10 degrees of environment. In order not to affect the use of solder paste, shall not be placed in the environment below zero, second, in the process of SMT proces
In PCBA manufacturing, automatic optical detection is set at the last step of the SMT production line. After the SMT patch processing is completed, product defect detection is required. Through timely detection and reduction of defects, improve assembly e
Quick solution to PCBA short-circuit problem: 1. Use short-circuit positioning analyzer for inspection, 2. Light up the short-circuit network on the PCB diagram. 3. In case of the same short-circuit in batches, take a board to operate the secant line and
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