The oxidation of sunken gold plate is the contamination of the gold surface by impurities. The impurities attached to the gold surface change color after oxidation, which leads to the oxidation of the gold surface.
With the reduction of the aperture, the original debris that has no effect on the larger aperture, pcb board factory, such as brush debris, volcanic ash, once remaining in the hole, will make the chemical precipitation of copper, copper plating will lose
Even the well-written and actually implemented technical specifications for PCB laminates do not specify the test items that must be carried out to determine that PCB laminates are the cause of manufacturing process problems.
the data is also used to check the component function. The data provided by the development department should be as easy as possible to apply directly to the test system or through simple transformations.
Copper coating can not only reduce the ground impedance, but also reduce the cross-sectional area of the loop and enhance the mirror loop of the signal. Therefore, copper coating process plays a very key role in PCB process, incomplete, truncated mirror l
The wiring design of electronic components has more and more influence on whether the test can be carried out well in the manufacture process of PCBA. Here are some important rules and practical tips.
From the point of view of function, the hole can be divided into two categories: one is used as an electrical connection between the layers; The second is used for fixing or positioning devices. If from the process, through the hole is generally divided i
After a lot of practice, the traditional aluminum plug process is changed, and white mesh is used to complete the circuit board surface welding and plug holes. Stable production and reliable quality.
These ground plane planes must be connected to the main ground plane through multiple through-holes. It should be noted that the existence of ground point will cause the inductance characteristics of the side to change, so the selection of inductance valu
This article is a summary of the author's experience in the actual development, hoping to help many RF IC developers shorten the development cycle, avoid unnecessary detours, save manpower and financial resources
Usually the same area, the more PCB layers, the more expensive the price. The design engineer should use as few layers as possible to complete the PCB design while ensuring the quality of the design signal.
scanning acoustic microscope shows its special advantage in nondestructive detection of multilayer high density PCB. And the general obvious explosion plate is only through the visual appearance can be detected.
