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one is that two lines walk on the same layer (side-by-side), the other is that two lines walk on two adjacent layers (over-under). Generally, there are many ways to implement the former side-by-side.
This technology has become a necessary means of detection in fine wire production, and is being rapidly popularized, applied and developed.
the thermal performance index analysis software module added in some professional PCB design software can help designers optimize circuit design.
there are still some differences between high frequency products and high speed products in the demand for plate.
In order to eliminate electrostatic discharge (ESD) interference and damage to electronic equipment, it is necessary to take a variety of technical measures to prevent.
PCB board is printed with solder paste, installed with electronic components, and then fixed by reflow welding.
There are three main types of metal substrate: aluminum substrate, copper substrate, iron substrate. Iron substrate is rarely used in the market, here the focus of analysis is aluminum substrate, copper substrate.
Industrial circuit boards should pay attention to heat dissipation problems; The second is printed board copper foil line, poor quality circuit board power supply line copper foil is very thin, easy to burn due to the current.
Wiring is generally divided into three levels: one is the layout, which is the most basic requirements of PCB design, the second is to meet the electrical performance, which is the standard to measure whether the circuit board is qualified. Three is beaut
Polygon filling deviation usually occurs when polygon plating copper on multi-grid circuit boards. While it does not have a standard based on a single grid, it can provide service beyond the required life of the boards.
Width and spacing of printed wire are important design parameters, which affect not only the electrical performance and electromagnetic compatibility of PCB board, but also the manufacturability and reliability of PCB board.
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