We can assemble the following types of single-sided and double-sided SMT printed circuit boards: Ball Grid Array (BGA), Ultra Fine Ball Grid Array (uBGA), Quad Flat Pack Lead Free (QFN), Quad Flat Pack (QFP), Small Outline Integrated Circuit (SOIC), Plast
Yes, we are fully capable of handling any type of custom SMT prototyping board requirements for you.
For BGA printed circuit board assembly, we have strict testing protocols including: X-ray inspection, functional testing, automated optical inspection.
We provide xx services. Kingford is your one stop turnkey PCB assembly factory. Looking forward to your inquiry
Medical Device PCBThe Printed Circuit Board (PCB) business has expanded its irresistible beneficial influence due to the continuous growth of the tech world and its use in various fields. In recent years, its impact on the world of electronics has exceede
The names of circuit boards are: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit
Computer board alias computer control board, control module, circuit control board, electric control board, refers to the core components of the computer controller, usually composed of hardware and software, used for large-scale equipment and system auto
The computing element is the embedded motherboard, which is the feature-rich small form factor that is the heart of the embedded system. Professional I/O such as video capture, communication ports, digital and analog signals are connected to the computing
It embellishes every highlight of modern life. Intelligent circuit boards connect circuit information at high speed in the most reliable tiny space, and intelligently optimize each circuit productKingford provides high-quality, reliable, low-carbon and en
The high-frequency hybrid splint includes a base plate, which is folded and positioned on the first inner wire layer, the first outer wire layer, and the top surface of the solder mask ink layer from top to bottom in order from bottom to top. The second l
The high-frequency hybrid splint includes a base plate, which is folded and positioned on the first inner wire layer, the first outer wire layer, and the top surface of the solder mask ink layer from top to bottom in order from bottom to top. The second l
4-layer HDI PCB is widely used in:Telecom modulewireless moduleLED display moduleHDI PCB (1+N+1): This is the simplest HDI PCB layout design structure, suitable for BGAs with fewer I/Os. It features fine lines, micro vias, and registration technology capa
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