High Power PCB Design

Embedded motherboard PCB design

Name: Embedded motherboard PCB design

Designable layers: 1-32 layers

Minimum line width and line spacing: 3mil

Minimum laser aperture: 4mil

Minimum mechanical aperture: 8mil

Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)

Peel strength: 1.25N/mm

Minimum punching hole diameter: single side: 0.9mm/35mil

Minimum hole diameter: 0.25mm/10mil

Aperture tolerance: ≤φ0.8mm±0.05mm

Hole tolerance: ±0.05mm

Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil

Hole resistance: double-sided/multi-layer: ≤300цΩ

Minimum line width: 0.127mm/5mil

Minimum pitch: 0.127mm/5mil

Screen printing color: black, white, red, green, etc.

Surface treatment: lead/lead-free tin spray, ENIG, silver, OSP

Service: Provide OEM service

Certificate: ISO9001.ROSH.UL

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Product Details Data Sheet

The computing element is the embedded motherboard, which is the feature-rich small form factor that is the heart of the embedded system. Professional I/O such as video capture, communication ports, digital and analog signals are connected to the computing center for the system to work.

The embedded motherboard is generally understood as the CPU board embedded in the device for control and data processing, that is, the "brain" of the device. Embedded into the device, of course, there will be stricter requirements on the volume and power consumption of the motherboard (the heat dissipation problem of the embedded motherboard).